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Introducing our newly shipped PCB, meticulously engineered to deliver outstanding performance and reliability. This 2-layer rigid PCB features the advanced Taconic TLF-35A fiberglass Ceramic-filled PTFE composites, intended to excel in high-frequency applications where signal integrity and efficiency are paramount.
The construction of this PCB showcases precision and attention to detail. With a board dimension of 141.5mm x 90mm, each piece is provided with a tight tolerance of +/-0.15mm, ensuring consistency and accuracy. The stackup consists of a 35μm copper layer on both sides, sandwiching the TLF-35A substrate with a thickness of 0.762mm (30mil), providing a sturdy foundation for your circuitry.
Featuring a minimum trace/space of 4/5 mils. The minimum hole size is 0.5mm, facilitating ease of assembly and accommodating a wide range of components. With no blind vias, the PCB ensures seamless connectivity across the board.
At a finished board thickness of 0.88mm, this PCB strikes a balance between durability and flexibility. The 1oz (1.4 mils) outer layer copper weight offers excellent electrical conductivity. The via plating thickness of 20μm ensures robust connections throughout the circuitry. The surface finish is done with immersion gold, providing a protective layer and enhancing solderability.
Both the top and bottom sides are coated with green solder mask, providing insulation and safeguarding against environmental factors. The absence of silkscreen allows for a clean and streamlined appearance. Prior to shipment, each PCB undergoes a rigorous 100% electrical test, ensuring optimal functionality and performance.
With 137 components and 190 pads, this PCB accommodates a wide range of circuit elements. It includes 131 thru-hole pads, 43 top SMT pads, and 16 bottom SMT pads, offering flexibility in component placement. With 211 vias and 9 nets, this PCB enables seamless connectivity and efficient signal transmission.
Compliant with IPC-Class-2 standards, this PCB adheres to strict quality requirements, ensuring consistent performance and reliability. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with various design software and manufacturing processes.
Our PCBs are available worldwide, and we are committed to providing exceptional customer support. For any technical inquiries or questions, please contact Ivy at sales10@bichengpcb.com. We are dedicated to delivering top-notch PCB solutions tailored to your unique requirements.
Property | Test Method | Units | Value | Units | Value |
Dielectric Constant @ 1.9 GHz | IPC-TM650 2.5.5.5.1 Mod | 3.50 ±0.05 | 3.50 ±0.05 | ||
Dissipation Factor @ 1.9 GHz | IPC-TM650 2.5.5.5.1 Mod | 0.0016 | 0.0016 | ||
Dissipation Factor @ 10 GHz | IPC-TM650 2.5.5.5.1 Mod | 0.0022 | 0.0022 | ||
Water Absorption | IPC-TM 650 2.6.2.1 | % | 0.03 | % | 0.03 |
Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | Lbs./linear inch | 10 | N/mm | 1.8 |
Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm·cm | 2.0 x 109 | Mohm·cm | 2.0 x 109 |
Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 3.0 x 108 | Mohm | 3.0 x 108 |
Flexural Strength Lengthwise | IPC-TM 650 650 2.4.4 | psi | 13000 | N/mm2 | 90 |
Flexural Strength Crosswise | IPC-TM 650 650 2.4.4 | psi | 13000 | N/mm2 | 90 |
Thermal Conductivity | IPC-TM 650 2.4.50 | W/m/K | 0.37 | W/m/K | 0.37 |
x-y CTE (50 ~ 150℃) | IPC-TM 650 2.4.41 | ppm/℃ | 9-12 | ppm/℃ | 9-12 |
z CTE (50 ~ 150℃) | IPC-TM 650 2.4.41 | ppm/℃ | 80 | ppm/℃ | 80 |
Flammability | UL-94 | V-0 | V-0 |
PCB Material: | Organic-ceramic, Woven glass reinforcement |
Designation: | TLF-35 |
Dielectric constant: | 3.5 |
Dissipation Factor | 0.0022 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
High-Performance PCB Material for Next-Generation Electronics
Introduction
TLF-35, a fiberglass Ceramic-filled PTFE composite material from
Taconic, has emerged as a leading choice for high-frequency PCB
applications. With exceptional electrical properties, thermal
stability, and mechanical strength, TLF-35 empowers engineers to
push the boundaries of electronic design. In this article, we
explore the key characteristics of TLF-35 and its significance in
delivering outstanding performance and reliability.
Exceptional Electrical Performance
TLF-35, with a dielectric constant of 3.50±0.05 at 1.9GHz, offers
excellent control over impedance and propagation characteristics,
ensuring optimal signal integrity in high-frequency applications.
Its low dissipation factor of 0.0016 at 1.9GHz and 0.0022 at 10GHz
minimizes signal loss and distortion, facilitating efficient signal
transmission. Furthermore, TLF-35 exhibits a volume resistivity of
2.0 x 10^9 Mohm.cm and a surface resistivity of 3.0 x 10^8 Mohm,
providing excellent electrical insulation properties for reliable
circuit operation.
Superior Mechanical Strength and Thermal Stability
TLF-35 combines remarkable mechanical strength with excellent
thermal stability, making it suitable for demanding environments.
With a flexural strength of 13,000 psi (90 M/mm^2) both lengthwise
and crosswise, TLF-35 ensures structural integrity and resistance
to bending or breaking. Its low water absorption rate of 0.03%
enhances dimensional stability and prevents degradation due to
moisture.
The material's thermal conductivity of 0.37 W/m/K enables efficient dissipation of heat, preventing overheating and maintaining optimal performance. TLF-35 exhibits a coefficient of thermal expansion (CTE) of 9-12 ppm/°C in the x-y direction and 80 ppm/°C in the z direction (50-150°C), ensuring minimal dimensional changes and reducing the risk of stress-induced failures in varying temperature environments.
Reliable and Safe
TLF-35 prioritizes reliability and safety with its exceptional peel
strength of 10 Lbs./linear inch (1.8 M/mm) for 1oz copper, ensuring
secure adhesion of copper layers. The material meets UL-94 V-0
flammability rating, providing excellent flame resistance and
enhancing safety in electronic applications.
Applications and Versatility
TLF-35 finds extensive applications in high-frequency PCB projects
across various industries. It is ideal for telecommunications,
aerospace, and computing applications, where signal integrity and
performance are critical. TLF-35 enables the development of base
stations, wireless communication systems, radar systems, satellite
technology, avionics, high-speed networking equipment, and advanced
test and measurement instruments. Its versatility and exceptional
properties make it a go-to choice for engineers seeking reliable
and high-performance PCB solutions.
Conclusion
TLF-35, a high-performance PCB material from Taconic, empowers
engineers to achieve exceptional electrical performance, mechanical
strength, and thermal stability in high-frequency designs. With its
outstanding properties, TLF-35 is revolutionizing the field of
electronic design, enabling the realization of cutting-edge
technologies and pushing the boundaries of innovation.
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