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Immersion Silver 2 Layer RF PCB Taconic 20mil 0.508mm TLY-3

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Immersion Silver 2 Layer RF PCB Taconic 20mil 0.508mm TLY-3

It is happy to introduce our newly shipped PCB, meticulously engineered to deliver outstanding performance and reliability. This 2-layer rigid PCB features the advanced Taconic TLY-3 woven fiberglass PTFE composites. Let's see the details of this PCB.


The construction of this PCB showcases precision and attention to detail. With a board dimension of 141.5mm x 163mm, each piece is manufactured with a tight tolerance of +/- 0.15mm, ensuring consistency and accuracy. The stackup consists of a 35μm copper layer on both sides, sandwiching the TLY-3 substrate with a thickness of 0.508mm (20mil), providing a sturdy foundation for your circuitry.


Featuring a minimum trace/space of 4/4 mils, this PCB allows for intricate and compact designs, enabling you to optimize space utilization. The minimum hole size is 0.35mm, facilitating ease of assembly and accommodating a wide range of components. With no blind vias, the PCB ensures seamless connectivity across the board.


At a finished board thickness of 0.63mm, this PCB strikes a balance between durability and flexibility. The 1oz (1.4 mils) outer layer copper weight offers excellent electrical conductivity. The via plating thickness of 20μm ensures robust connections throughout the circuitry. The surface finish is done with immersion silver, providing a protective layer and enhancing solderability.


Both the top side and bottom side are coated with green solder mask, providing insulation and safeguarding against environmental factors. The absence of silkscreen allows for a clean and streamlined appearance. Prior to shipment, each PCB undergoes a rigorous 100% electrical test, ensuring optimal functionality and performance.


With 183 components and 250 pads, this PCB accommodates a wide range of circuit elements. It includes 139 thru-hole pads, 92 top SMT pads, and 19 bottom SMT pads, offering flexibility in component placement. With 90 vias and 8 nets, this PCB enables seamless connectivity and efficient signal transmission.


Compliant with IPC-Class-2 standards, this PCB adheres to strict quality requirements, ensuring consistent performance and reliability. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with various design software and manufacturing processes.


Our PCBs are available worldwide, and we are committed to providing exceptional customer support. For any technical inquiries or questions, please contact Ivy at sales10@bichengpcb.com. We are dedicated to delivering top-notch PCB solutions tailored to your unique requirements.


TLY TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK at 10 GHzIPC-650 2.5.5.52.22.2
Df at 10 GHzIPC-650 2.5.5.50.00090.0009
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Dielectric StrengthASTM D 149V/mil2,693V/mil106,023
Volume ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms/cm1010Mohms/cm1010
Volume ResistivityIPC-650 2.5.17.1(after humidity)Mohms/cm1010Mohms/cm109
Surface ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms108Mohms108
Surface ResistivityIPC-650 2.5.17.1(after humidity)Mohms108Mohms108
Flex Strength(MD)IPC-650 2.4.4psi14,057N/mm296.91
Flex Strength(CD)IPC-650 2.4.4psi12,955N/mm289.32
Peel Stength(½ oz.ed copper)IPC-650 2.4.8Ibs./inch11N/mm1.96
Peel Stength(1 oz.CL1 copper)IPC-650 2.4.8Ibs./inch16N/mm2.86
Peel Stength(1 oz..CV1 copper)IPC-650 2.4.8Ibs./inch17N/mm3.04
Peel StengthIPC-650 2.4.8(after elevated temp.)Ibs./inch13N/mm2.32
Young's Modulus(MD)ASTM D 3039/IPC-650 2.4.19psi1.4 x 106N/mm29.65 x 103
Poisson's Ratio(MD)ASTM D 3039/IPC-650 2.4.190.210.21
Thermal ConductivityASTM F 433W/M*K0.22W/M*K0.22
Dimensional Stability(MD,10mil)IPC-650 2.4.39(avg.after bake&thermal stress)mils/inch-0.038-0.038
Dimensional Stability(CD,10mil)IPC-650 2.4.39(avg.after bake&thermal stress)mils/inch-0.031-0.031
Density(Specific Gravity)ASTM D 792g/cm32.19g/cm32.19
CTE(X axis)(25-260℃)ASTM D 3386(TMA)ppm/℃26ppm/℃26
CTE(Y axis)(25-260℃)ASTM D 3386(TMA)ppm/℃15ppm/℃15
CTE(Z axis)(25-260℃)ASTM D 3386(TMA)ppm/℃217ppm/℃217
NASA Outgassing(% TML)0.010.01
NASA Outgassing(% CVCM)0.010.01
NASA Outgassing(% WVR)0.000.00
UL-94 Flammability RatingUL-94V-0V-0

Immersion Silver 2 Layer RF PCB Taconic 20mil 0.508mm TLY-3


Introducing TLY-3: Empowering High-Frequency PCB Applications with Exceptional Performance


Taconic's TLY-3, a woven fiberglass PTFE composite material, has established itself as a leading choice for high-frequency PCB applications. With its outstanding electrical properties, thermal stability, and mechanical strength, TLY-3 enables engineers to push the boundaries of electronic design. Let's delve into the key characteristics of TLY-3 and explore its significance in delivering unparalleled performance and reliability.


Advantages of TLY-3 Material:

1. Excellent Electrical Performance: TLY-3 features a low dielectric constant (DK) of 2.33 at 10 GHz/23°C. This characteristic ensures precise control over impedance and optimal signal propagation, facilitating efficient signal transmission and reducing the risk of signal distortion.


2. Stable Performance Across Temperature Range: TLY-3 exhibits remarkable thermal stability, operating flawlessly within a temperature range of -40℃ to +85℃. This stability ensures consistent electrical performance, even in demanding temperature environments, enhancing the reliability and longevity of high-frequency PCBs.


3. Low Loss and High Signal Integrity: With a low dissipation factor, TLY-3 minimizes signal loss and distortion, preserving signal integrity in high-frequency applications. This advantage is of paramount importance for maintaining the overall system performance and ensuring accurate data transmission.


4. Robust Mechanical Properties: TLY-3's woven fiberglass reinforcement provides exceptional mechanical strength and dimensional stability. This robustness enhances the rigidity of the PCB, making it resistant to bending, warping, and other mechanical stresses. It ensures the durability and reliability of the PCB in various operating conditions.


5. Wide Range of Applications: TLY-3 finds extensive utility in diverse high-frequency applications, including telecommunications, aerospace, radar systems, wireless communication systems, and high-speed networking equipment. Its exceptional electrical and mechanical properties make it an ideal choice for demanding electronic designs.


6. Compatibility with Manufacturing Processes: TLY-3 material seamlessly integrates into standard PCB manufacturing processes. It can be utilized for various PCB configurations, ranging from single-layer to multilayer designs, facilitating smooth production and reducing implementation complexities.


7. High-Quality and Reliability: Taconic's commitment to quality is reflected in the exceptional performance of TLY-3. The material undergoes rigorous testing and quality control measures, ensuring consistent electrical characteristics and mechanical reliability. Designers can rely on TLY-3 for high-quality PCBs that meet stringent performance requirements.


TLY-3, with its exceptional electrical performance, thermal stability, mechanical strength, and compatibility, empowers engineers to achieve new heights in high-frequency PCB design. It enables the realization of cutting-edge technologies and pushes the boundaries of innovation in the field of electronic design. Trust TLY-3 to deliver outstanding performance and reliability in your high-frequency PCB applications.


Quality Immersion Silver 2 Layer RF PCB Taconic 20mil 0.508mm TLY-3 for sale
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