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Brand Name : | Bicheng |
Certification : | UL, ISO9001, IATF16949 |
Price : | USD 9.99-99.99 |
Payment Terms : | T/T |
Supply Ability : | 5000PCS per month |
Delivery Time : | 8-9 working days |
Introducing our newly shipped RF-60TC PCB, a cutting-edge solution provided to meet the demanding requirements of high-frequency applications. With its advanced features and exceptional performance, this PCB is perfect for a wide range of applications, from high power amplifiers to satellite systems.
The RF-60TC PCB is constructed using glass reinforced PTFE ceramic composites, offering superior characteristics that ensure reliable and efficient operation. Its dielectric constant (Dk) of 6.15 at 10 GHz and dissipation factor of 0.002 at 10 GHz/23°C provide excellent signal integrity and minimize losses, resulting in improved overall performance. The thermal coefficient of Dk of -3.58 ppm/°C during -50°C to 150°C enables stable performance across varying temperatures.
One of the standout benefits of the RF-60TC PCB is its improved loss tangent, which enhances signal transmission and reduces interference. Additionally, the high thermal conductivity ensures efficient heat dissipation, enabling the PCB to withstand demanding operating conditions. The enhanced dimensional stability and low Z-axis coefficient of thermal expansion (CTE) of 40 ppm/°C offer reliability and resistance to mechanical stress.
The RF-60TC PCB demonstrates excellent adhesion to metal, providing a robust and reliable connection. Its stable DK over frequency and temperature ensures consistent performance across different environments. Furthermore, the PCB exhibits low moisture absorption, enhancing its durability and longevity.
The stackup of the RF-60TC PCB features a 2-layer rigid design, consisting of copper layers with a thickness of 35 μm and a Taconic Core RF-60TC of 0.762 mm (30mil). With a finished board thickness of 0.8mm and a 1 oz (1.4 mils) outer layer copper weight, this PCB strikes the perfect balance between durability and flexibility. The 20 μm via plating thickness and immersion gold surface finish further enhance the PCB's reliability and conductivity.
Measuring at 43.88mm x 33.19mm, the RF-60TC PCB offers a compact form factor while maintaining precise dimensions with a tolerance of +/- 0.15mm. The minimum trace/space of 6/7 mils and minimum hole size of 0.40mm enable intricate designs and high-density circuitry. The absence of blind vias simplifies the manufacturing process, allowing for seamless integration into your projects.
To ensure the highest quality standards, every RF-60TC PCB undergoes a 100% electrical test prior to shipment. It adheres to the IPC-Class-2 standard, guaranteeing reliability and performance.
With 25 components, 68 pads (including 47 thru-hole pads and 21 top SMT pads), 42 vias, and 4 nets, the RF-60TC PCB offers versatility and compatibility with a wide range of electronic systems.
The RF-60TC PCB's exceptional performance makes it an ideal choice for various applications, including high power amplifiers, miniaturized antennas, GPS, patch and RFID readers, filters, couplers, dividers, and satellites. Its global availability ensures easy access to this high-quality PCB solution.
For any technical inquiries or further information, please contact Ivy at sales10@bichengpcb.com. We are here to assist you in bringing your projects to life with our state-of-the-art RF-60TC PCB.
Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 6.15 ± 0.15 | 6.15 ± 0.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.002 | 0.002 | ||
TcK | ppm/°C | -3.581 | ppm/°C | -3.581 | |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 |
Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 |
Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 |
Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 |
Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 |
Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 |
Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 |
Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.155 | 0.155 | ||
Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 |
Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 |
Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 |
Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 |
CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 |
CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 |
Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 |
Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 |
Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 |
Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 |
Flammability Rating | UL 94 | V-0 | V-0 |
RF-60TC PCB: Unleashing the Power of High-Frequency Applications
Introduction:
In the ever-evolving landscape of technology, high-frequency
applications demand cutting-edge solutions that deliver exceptional
performance and reliability. Introducing the RF-60TC PCB, the
RF-60TC PCB is set to transform the way we approach high-frequency
electronics.
Unparalleled Performance and Reliability:
The RF-60TC PCB stands out in the market for its unmatched
performance and reliability. Constructed using glass reinforced
PTFE ceramic composites, this PCB offers exceptional signal
integrity and minimizes losses. Its dielectric constant (Dk) of
6.15 at 10 GHz and low dissipation factor (Df) of 0.002 ensure
precise and efficient signal transmission. Additionally, the
RF-60TC PCB exhibits remarkable dimensional stability and
mechanical strength, making it a reliable choice for critical
applications.
PCB Material: | PTFE based, ceramic filled fiberglass |
Designation: | RF-60TC |
Dielectric constant: | 6.15 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Cutting-Edge Features for High-Frequency Applications:
The RF-60TC PCB incorporates cutting-edge features that make it
ideal for high-frequency applications. Its low loss tangent
enhances signal integrity, reducing interference and enabling
accurate data transmission. The PCB's high thermal conductivity
ensures efficient heat dissipation, allowing it to withstand the
demanding operating conditions of high-power systems. Furthermore,
the RF-60TC PCB demonstrates excellent adhesion to metal, providing
a robust and reliable connection.
The Science Behind RF-60TC: Properties and Specifications:
To understand the RF-60TC PCB better, let's delve into its
properties and specifications. With a dielectric constant of 6.15 ±
0.15 at 10 GHz, the RF-60TC PCB maintains stable performance across
different frequencies. Its dissipation factor of 0.002 guarantees
minimal signal loss, resulting in optimal performance. The thermal
coefficient of Dk of -3.581 ppm/°C ensures consistent performance
over a wide temperature range.
Enhancing Signal Integrity with Low Loss Tangent:
Signal integrity is crucial in high-frequency applications, and the
RF-60TC PCB excels in this aspect. Its low loss tangent minimizes
signal attenuation and distortion, allowing for accurate and
reliable data transmission. This feature is particularly beneficial
in applications such as high power amplifiers, miniaturized
antennas, GPS systems, and patch and RFID readers.
Optimal Thermal Management for Demanding Environments:
High-frequency applications often generate substantial heat, making
thermal management critical. The RF-60TC PCB's high thermal
conductivity of 0.9 W/M*K ensures efficient heat dissipation,
preventing overheating and maintaining optimal performance. This
feature is invaluable in applications where thermal stability is
essential, such as satellite systems and high-power amplifiers.
Durable and Resilient: Stability and Mechanical Strength:
The RF-60TC PCB is built to withstand challenging conditions. Its
exceptional dimensional stability and low Z-axis coefficient of
thermal expansion (CTE) of 40 ppm/°C ensure reliable performance
under varying temperatures and mechanical stress. With flexural and
tensile strength of up to 10,000 psi(continued) and 9,000 psi
respectively, the RF-60TC PCB offers remarkable mechanical
strength, making it resistant to bending and stretching. These
properties make it an ideal choice for applications where stability
and durability are paramount.
Applications and Industries for RF-60TC PCB:
The RF-60TC PCB finds extensive use in high-frequency applications
across various industries. In the telecommunications sector, it
enables the development of high-speed data transmission systems and
5G infrastructure. In aerospace applications, the RF-60TC PCB
ensures reliable communication and navigation systems. The
automotive industry benefits from its use in radar systems,
collision avoidance, and advanced driver-assistance systems.
Additionally, the RF-60TC PCB finds applications in medical
devices, industrial automation, and military equipment, among
others.
Conclusion: Elevate Your Projects with RF-60TC:
The RF-60TC PCB sets a new standard for high-frequency applications
with its exceptional performance, reliability, and advanced
features. Whether you're working on telecommunications, aerospace,
automotive, or any other high-frequency project, the RF-60TC PCB
delivers unmatched signal integrity, thermal management, and
mechanical strength. By choosing the RF-60TC PCB, you're investing
in a reliable and versatile solution that will elevate your
projects to new heights of success.
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