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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
5 Years
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| Brand Name : | Bicheng |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99/PCS |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
Introduction
Today we'll be discussing a high-frequency PCB with a lower dielectric constant called DiClad 870 microwave PCB.
DiClad 870 is a Rogers laminate that utilizes woven fiberglass reinforced, PTFE-based composites. This unique composition enables a stable, lower dielectric constant by reducing the number of fiberglass plies and increasing the PTFE content. As a result, it supports wider line widths, reducing insertion loss.
Now, let's dive into the data sheet to explore the properties of DiClad 870.
Typical Properties of DiClad 870
DiClad 870 exhibits excellent electrical properties. It has a dielectric constant of 2.33 at both 1 MHz and 10 GHz, with a low dissipation factor of 0.0009 at 1 MHz and 0.0013 at 10 GHz.
The thermal coefficient of dielectric constant ranges from -161 ppm/°C to -10°C to +140°C.
DiClad 870 boasts a high volume resistivity of 1.5 x 10^9 MΩ-cm and a surface resistivity of 3.4 x 10^7 MΩ.
Moreover, it demonstrates an impressive arc resistance of over 180 seconds, tested according to ASTM D-495 using the D48/50 method. Similarly, the dielectric breakdown voltage exceeds 45 kV, tested according to ASTM D-149 using the D48/50 method.
In terms of mechanical properties, DiClad 870 exhibits a peel strength of 14 lbs. per inch after thermal stress. It also shows excellent tensile modulus, tensile strength, compressive modulus, and flexural modulus at 23°C.
When it comes to thermal properties, DiClad 870 offers a low coefficient of thermal expansion of 17 ppm/°C (X axis), 29 ppm/°C (Y axis), and 217 ppm/°C (Z axis) within the temperature range of 0°C to 100°C. However, its thermal conductivity is only 0.257 W/mK at 100°C.
| Property | DiClad 870 | Condition | Test Method |
| Electrical Properties | |||
| Dielectric Constant @ 10 GHz | 2.33 | C23/50 | IPC TM-650 2.5.5.5 |
| Dielectric Constant @ 1 MHz | 2.33 | C23/50 | IPC TM-650 2.5.5.3 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 1 MHz | 0.0009 | C23/50 | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Er (ppm/°C) | -161 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 3.4 x 10 7 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance | >180 | D48/50 | ASTM D-495 |
| Dielectric Breakdown (kV) | >45 | D48/50 | ASTM D-149 |
| Mechanical Properties | |||
| Peel Strength (lbs.per inch) | 14 | After Thermal Stress | IPC TM-650 2.4.8 |
| Tensile Modulus (kpsi) | 485(MD), 346(CD) | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 14.9(MD), 11.2 (CD) | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 327 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 437 | A, 23°C | ASTM D-790 |
| Thermal Properties | |||
| Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis | 17 29 217 | 0°C to 100°C | IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer |
| Thermal Conductivity (W/mK) | 0.257 | 100°C | ASTM E-1225 |
| Flammability UL | Meets requirements of UL94-V0 | C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
| Physical Properties | |||
| Density (g/cm3) | 2.26 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.02 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 0.00 0.01 NO | 125°C, ≤ 10-6 torr | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% |
DiClad 870 meets the UL94-V0 flammability rating, ensuring its safety.
Let's now explore the physical properties of DiClad 870.
It has a density of 2.26 g/cm3 at 23°C, indicating its dense and sturdy nature.
With a water absorption rate of 0.02%, DiClad 870 demonstrates low water absorption.
Lastly, let's look at the outgassing characteristics.
Outgassing refers to the release of volatile materials during use. DiClad 870 shows minimal outgassing with a total mass loss of 0.02%, collected volatile condensable material of 0.00%, and water vapor regain of 0.01% at 125°C and ≤ 10^-6 torr, with no visible condensate.
Our PCB Capability (DiClad 870)
We offer a range of options for DiClad 870 PCBs, including single-sided, double-sided, multi-layer, and hybrid types.
The available thicknesses for DiClad 870 PCBs are 31 mils, 93 mils, and 125 mils.
You can choose between 1oz and 2oz finished copper on the track lines.
The maximum size for a DiClad 870 PCB is 400mm by 500mm, and it can be a single board or a panel with different designs.
We offer solder mask colors such as green, black, blue, red, and yellow.
For pad surface finishes, we provide options like immersion gold, HASL, immersion silver, immersion tin, OSP, ENEPIG, pure gold, and bare copper.
| PCB material: | Woven Fiberglass reinforced PTFE Laminates |
| Designation: | DiClad 870 |
| Dielectric constant: | 2.3 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 31mil (0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold, Bare copper, etc.. |
This type of PCB is commonly used in applications such as radar feed networks, commercial phased array networks, low-loss base station antennas, and RF components like filters and couplers.
DiClad 870 materials are compatible with conventional electroless copper and direct deposit metallization processes, enabling the use of standard equipment and chemical processes for plating, imaging, and etching circuit patterns on the material.
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