Material Introduction

TSM-DS3 is an exceptional thermally stable material that boasts industry-leading low loss properties with a dissipation factor (DF) of 0.0011 at 10 GHz. It offers the predictability and consistency comparable to the best fiberglass reinforced epoxies available in the market.

TSM-DS3 stands out as a ceramic-filled reinforced material with a remarkably low fiberglass content of approximately 5%. This unique composition allows it to rival epoxies in fabricating large format complex multilayers, making it an ideal choice for demanding applications.

One of the key highlights of TSM-DS3 is its suitability for high power applications. With a high thermal conductivity (TC) of 0.65 W/m*K, this material efficiently conducts heat away from other heat sources in a printed wiring board (PWB) design. This capability ensures effective heat dissipation and helps maintain optimal performance in high-power scenarios.

Moreover, TSM-DS3 has been developed to exhibit very low coefficients of thermal expansion, making it highly suitable for applications that undergo demanding thermal cycling. This exceptional feature enhances the material's performance and reliability, providing stability even in environments with significant temperature variations.

Features

1.TSM-DS3 offers an industry-leading dissipation factor (DF) of 0.0011 at 10GHz

2. With high thermal conductivity, TSM-DS3 effectively conducts heat away from heat sources.

3.The material has a low fiberglass content of approximately 5%.

4.TSM-DS3 exhibits dimensional stability comparable to epoxy materials.

5. It enables the fabrication of large format, high layer count printed wiring boards (PWBs) with complex designs.

6. The material allows for the successful construction of complex PCBs with high yield and consistent performance.

7. TSM-DS3 maintains stable dielectric constant (DK) within +/- 0.25 across a wide temperature range (-30 °C to 120 °C).

8. It is compatible with resistor foils, expanding its range of applications.

Typical Applications

TSM-DS3 finds application in various fields, including:

1. Couplers

2. Phased Array Antennas

3. Radar Manifolds

4. mmWave Antennas

5. Oil Drilling

6. Semiconductor / Automatic Test Equipment (ATE) Testing

Our PCB Capability (TSM-DS3)

TSM-DS3 Typical Values

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners