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0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG

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    Buy cheap 0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG from wholesalers
     
    Buy cheap 0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG from wholesalers
    • Buy cheap 0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG from wholesalers
    • Buy cheap 0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG from wholesalers
    • Buy cheap 0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG from wholesalers

    0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG

    Sharing a new RF PCB made of TU-768 material. The TU-768 laminate by Taiwan Union is a high-Tg (glass transition temperature) and high thermal reliability laminate designed to meet rigorous performance requirements. It is accompanied by TU-768P, a matching prepreg for enhanced functionality. These laminates and prepregs are constructed using high-quality woven E-glass coated with an epoxy resin system, offering UV-block characteristics and compatibility with automated optical inspection (AOI) processes. The TU-768 series is well-suited for applications that demand resilience against thermal cycles and extensive assembly work. Notably, TU-768 laminates exhibit exceptional CTE (coefficient of thermal expansion), superior chemical resistance, thermal stability, and CAF (conductive anodic filament) resistance properties.


    Key Features:
    - Dk (dielectric constant) of 4.3 at 10GHz
    - Dissipation factor of .0023 at 10GHz
    - CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C
    - Coefficient of thermal expansion matched to copper
    - Decomposition Temperature (Td) of 350 °C TGA
    - Tg (glass transition temperature) of 180°C
    - High thermal reliability with T260 >60 min, T288>15 min, T300 >2 min


    Benefits:
    - Compatible with lead-free processes
    - Excellent coefficient of thermal expansion for stability
    - Anti-CAF (conductive anodic filament) property for improved reliability
    - Superior chemical and thermal resistance
    - Fluorescent properties enable AOI (automated optical inspection)
    - Resistant to moisture-related issues


    Typical ValuesConditioningIPC-4101 /126
    Thermal
    Tg (DMA)190°C
    Tg (DSC)180°C> 170°C
    Tg (TMA)170°CE-2/105
    Td (TGA)350°C> 340°C
    CTE x-axis11~15 ppm/°CN/A
    CTE y-axis11~15 ppm/°CE-2/105N/A
    CTE z-axis2.70%< 3.0%
    Thermal Stress,Solder Float, 288°C> 60 secA> 10 sec
    T260> 60 min> 30 min
    T288> 20 minE-2/105> 15 min
    T300> 2 min> 2 min
    Flammability94V-0E-24/12594V-0
    DK & DF
    Permittivity (RC 50%) @10GHz4.3
    Loss Tangent (RC 50%) @10GHz0.018
    Electrical
    Permittivity (RC50%)
    1GHz (SPC method/4291B)4.4 / 4.3< 5.2
    5GHz (SPC method)4.3E-2/105N/A
    10GHz (SPC method)4.3N/A
    Loss Tangent (RC50%)
    1GHz (SPC method/4291B)0.019 /0.018< 0.035
    5GHz (SPC method)0.021E-2/105N/A
    10GHz (SPC method)0.023N/A
    Volume Resistivity> 1010 MΩ•cmC-96/35/90> 106 MΩ•cm
    Surface Resistivity> 108 MΩC-96/35/90> 104 MΩ
    Electric Strength> 40 KV/mmA> 30 KV/mm
    Dielectric Breakdown> 50 kVA> 40 KV
    Mechanical
    Young’s Modulus
    Warp Direction25 GPaAN/A
    Fill Direction22 GPa
    Flexural Strength
    Lengthwise> 60,000 psiA> 60,000 psi
    Crosswise> 50,000 psiA> 50,000 psi
    Peel Strength, 1.0 oz RTF Cu foil7~9 lb/inA> 4 lb/in
    Water Absorption0.18%E-1/105+D-24/23< 0.8 %

    PCB Stackup:
    This PCB is a 2-layer rigid PCB design with the following specifications:
    - Copper_layer_1: 35 μm
    - TU-768 Core: 0.76 mm
    - Copper_layer_2: 35 μm


    PCB Construction Details:
    - Board dimensions: 47.8mm x 47.8mm (1PCS), with a tolerance of +/- 0.15mm
    - Minimum Trace/Space: 4/4 mils, allowing for precise circuitry
    - Minimum Hole Size: 0.2mm, providing flexibility for component placement
    - No blind vias, simplifying the manufacturing process
    - Finished board thickness: 0.8mm, balancing durability and compactness
    - Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring efficient conduction
    - Via plating thickness: 20 μm, enabling reliable interconnectivity
    - Surface finish: Immersion Gold, for protection and improved conductivity
    - Top Silkscreen: White, facilitating component identification
    - Bottom Silkscreen: None, for a clean and minimalistic appearance
    - Top Solder Mask: Black, enhancing soldering and protection
    - Bottom Solder Mask: None, for a simplified PCB design
    - Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and functionality


    PCB Statistics:
    - Components: 11, providing versatility for various applications
    - Total Pads: 24, facilitating component connectivity
    - Thru Hole Pads: 15, enabling secure connections
    - Top SMT Pads: 9, supporting surface mount technology (SMT) components
    - Bottom SMT Pads: 0, indicating single-sided SMT assembly
    - Vias: 7, allowing for efficient signal routing
    - Nets: 2, ensuring proper connectivity


    PCB Material:High-Tg and High Thermal Reliability Epoxy Resin
    Designation:TU-768
    Dielectric constant:4.3
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
    PCB thickness:10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
    Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

    0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG


    Artwork Supplied:
    This PCB artwork is provided in Gerber RS-274-X format, a widely used industry standard for PCB manufacturing. This format ensures compatibility and accuracy during the fabrication process.


    Quality Standard and Availability:
    The PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliability. It is available for purchase worldwide, making it accessible to customers globally.


    Typical Applications:

    The TU-768 PCB is widely applicable in various fields, including:
    - Consumer Electronics
    - Servers and workstations
    - Automotive industry


    With its high-Tg and thermal reliability features, the TU-768 PCB is an excellent choice for demanding electronic applications that require exceptional performance and durability.


    0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG

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