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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
5 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99/PCS-99.99/PCS |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
Introduction:
It's very happy to introduce our newly shipped PCB which made of
RO4003C laminates. RO4003C laminates are cost-effective microwave
materials known for their precise control over dielectric constant
(ε) and low loss. They are available in different configurations,
utilizing 1080 and 1674 glass fabric styles. Unlike PTFE-based
microwave materials, RO4003C laminates do not require special
handling procedures or through-hole treatments. These laminates are
non-brominated and do not have a UL 94 V-0 rating.
Features:
RO4003C laminates are composed of woven glass reinforced
hydrocarbon/ceramics. They have a dielectric constant (DK) of 3.38
± 0.05 at 10 GHz and a dissipation factor (tan δ) of 0.0027 at the
same frequency. The laminates exhibit a thermal conductivity of
0.71 W/m/°K. The coefficient of thermal expansion (CTE) is 11
ppm/°C in the X-axis, 14 ppm/°C in the Y-axis, and 46 ppm/°C in the
Z-axis. The glass transition temperature (Tg) is greater than 280
°C, and the laminates can operate within a temperature range of
-40℃ to +85℃.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits:
RO4003C laminates offer excellent electrical performance with low
dielectric tolerance and low loss. They maintain stable electrical
properties across a wide frequency range. The laminates exhibit a
low thermal coefficient of dielectric constant, providing
dimensional stability. They also offer reliable plated through
holes with low Z-axis expansion. With a low in-plane expansion
coefficient, RO4003C laminates remain stable over a range of
circuit processing temperatures. Moreover, these laminates are
cost-effective compared to conventional microwave laminates. They
are also resistant to conductive anodic filamentation (CAF).
PCB Stackup:
This PCB is a 2-layer rigid construction, the stackup consists of a
35 μm copper layer on the top, a 0.813 mm (32 mil) RO4003C core,
and another 35 μm copper layer on the bottom.
PCB Construction Details:
The dimensions for this PCB.It's two types of the design. The size
are 265mm x 66.88mm with a tolerance of +/- 0.15mm. The minimum
trace/space is 6/5 mils, and the minimum hole size is 0.35mm. The
PCB does not have blind vias, and the finished board thickness is
0.9mm. The outer copper layer weight is 1 oz (1.4 mils), and the
via plating thickness is 20 μm. The surface finish is immersion
gold, while the top and bottom silkscreens are white. The solder
masks are green on both sides. A 100% electrical test is conducted
prior to shipment.
PCB Statistics:
This PCB consists of 66 components and has a total of 153 pads,
including 81 through-hole pads and 72 top surface mount technology
(SMT) pads. The PCB does not have bottom SMT pads. It includes 120
vias and 4 nets.
Supplied Artwork Type and Quality Standard:
The supplied artwork type is Gerber RS-274-X, and the quality
standard is IPC-Class-2.
Availability:
This PCB made of RO4003C laminates are available worldwide.
Typical Applications:
RO4003C laminates are commonly used in cellular base station
antennas and power amplifiers, RF identification tags, automotive
radar and sensors, and LNBs (Low Noise Block downconverters) for
direct broadcast satellites.
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