Today, we are exciting to update the introduction of RO4725JXR antenna grade PCB, which offers a reliable and efficient alternative to traditional PTFE-based laminates commonly used in antenna design.

RO4725JXR antenna grade laminates possess exceptional mechanical and electrical properties, allowing antenna designers to achieve significant gain values while minimizing signal loss. These materials are compatible with standard epoxy and high-temperature lead-free solder processing. They also eliminate the need for special treatment during plated through hole preparation, and lamination can be accomplished using the RO4400 bondply series at a temperature of 175°C.

Here are some key details from the data sheet:

RO4725JXR has a process dielectric constant of 2.55 ± 0.05 in the Z direction at 10 GHz and 23°C, as measured by the IPC-TM-650, 2.5.5.5 test method. Its design dielectric constant is 2.64 in the Z direction at frequencies ranging from 1.7 GHz to 5 GHz, measured by the differential phase length method.

The material exhibits a dissipation factor of 0.0026 in the Z direction at 10 GHz and 23°C, according to the IPC-TM-650, 2.5.5.5 test method. At 2.5 GHz, the dissipation factor is 0.0022.

Its thermal coefficient of dielectric constant is +34 ppm/°C in the Z direction across a temperature range of -50°C to 150°C, as measured by the IPC-TM-650, 2.5.5.5 test method.

The volume resistivity is 2.16 X 10^8 MΩ•cm, and the surface resistivity is 4.8 X 10^7 MΩ, both measured under COND A using the IPC-TM-650, 2.5.17.1 test method.

The material demonstrates a remarkably low PIM (Passive Intermodulation) value of -166 dBc at 50 ohm on 0.060" thick material, with a power level of 43 dBm at 1900MHz.

It has an electrical strength of 630 V/mil at 0.030", as measured by the IPC-TM-650, 2.5.6.2 test method.

The flexural strength is 121 MPa in the MD (Machine Direction) and 92 MPa in the CMD (Cross-Machine Direction), determined by the ASTM D790 test method at room temperature.

RO4725JXR exhibits dimensional stability of less than 0.4 mm/m in the X and Y directions after etching, under the E2/150°C condition, as measured by the IPC-TM-650, 2.4.39A test method.

Its coefficient of thermal expansion is 13.9 ppm/°C in the X direction, 19.0 ppm/°C in the Y direction, and 25.6 ppm/°C in the Z direction across a temperature range of -55°C to 288°C, according to the IPC-TM-650, 2.1.24 test method.

The thermal conductivity of RO4725JXR is 0.38 W/mK° at 50°C, as measured by the ASTM D5470 test method.

Its moisture absorption is 0.24% at 48 hours and 50ºC, measured by the IPC-TM-650 2.6.2.1 and ASTM D570 test methods.

The material has a Tg (glass transition temperature) value greater than 280°C, measured by the IPC-TM-650 2.4.24 test method, and a Td (decomposition temperature) value of 439°C, measured by the ASTM D3850 test method.

Its density is 1.27 gm/cm3, as measured by the ASTM D792 test method.

The copper peel strength is 8.5 pli for 1 oz LoPro ED copper, according to the IPC-TM-650 2.4.8 test method.

RO4725JXR is also compatible with lead-free processes.

In conclusion, the introduction of RO4725JXR antenna grade PCB offers antenna designers a reliable and efficient alternative to traditional PTFE-based laminates. This material provides exceptional mechanical and electrical properties while minimizing signal loss. Its low PIM performance, reaching levels even better than -164dBc, ensures high-quality voice, data, and video communications in antenna systems.

By choosing RO4725JXR as the PCB material for base station antennas and other passive components like couplers and filters, designers can achieve low PIM levels without compromising electrical and mechanical performance. The selection of the right PCB material is crucial in determining the final achievable PIM, and RO4725JXR proves to be a superior option in this regard.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners