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6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit

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    Buy cheap 6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit from wholesalers
     
    Buy cheap 6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit from wholesalers
    • Buy cheap 6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit from wholesalers

    6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit

    Introducing our Hybrid PCB: a cutting-edge solution that combines the benefits of Tg170 FR-4 and 20mil RO4003C materials to deliver exceptional performance and versatility. This hybrid design allows for the integration of different functionalities, making it ideal for a wide range of applications.


    Features:


    Mixed-Signal Compatibility:
    Our Hybrid PCB supports both analog and digital signals, thanks to the combination of Tg170 FR-4 and 20mil RO4003C materials. The FR-4 portion ensures reliable performance for standard circuitry, while the RO4003C portion provides excellent high-frequency characteristics for RF/microwave signals.


    High-Frequency Performance:
    The RO4003C material excels in high-frequency applications with its low dielectric loss and superior signal integrity. This results in efficient signal transmission, minimal loss, and reduced signal distortion, making it ideal for demanding RF/microwave applications.


    Thermal Management:
    The inclusion of FR-4 in our Hybrid PCB enhances thermal conductivity, enabling effective heat dissipation from components. This feature is particularly valuable for applications that require efficient thermal management to maintain optimal performance.


    Design Flexibility:
    Our Hybrid PCB offers unparalleled design flexibility, allowing for the integration of different technologies and materials. Designers can strategically optimize the layout and material selection for each section of the board, tailoring it precisely to the requirements of specific functionalities.


    Cost Optimization:
    By selectively incorporating RO4003C where high-frequency performance is required, our Hybrid PCB optimizes costs. The utilization of FR-4 for other sections provides a cost-effective solution without compromising performance, making it an economical choice compared to using high-frequency materials throughout the entire board.


    Compatibility:
    Both Tg170 FR-4 and RO4003C are fully compatible with standard PCB fabrication processes, ensuring seamless manufacturing and assembly. This compatibility simplifies the integration of our Hybrid PCB into existing production workflows.


    PCB Stackup:
    Our Hybrid PCB features a 6-layer rigid construction with the following stackup:

    Copper Layer 1: 35 μm
    RO4003C: 0.508 mm (20mil)
    Copper Layer 2: 35 μm
    Prepreg: 0.102 mm
    Copper Layer 3: 35 μm
    Tg170°C FR-4: 0.254 mm
    Copper Layer 4: 35 μm
    Prepreg: 0.102 mm
    Copper Layer 5: 35 μm
    Tg170°C FR-4: 0.508 mm
    Copper Layer 6: 35 μm


    6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit


    PCB Construction Details:

    Board Dimensions: 356mm x 373mm (+/- 0.15mm) in 3 types, totaling 3 pieces
    Minimum Trace/Space: 4/4 mils, ensuring precise circuit design and layout
    Minimum Hole Size: 0.35mm, supporting fine-pitch components and high-density interconnects
    No Blind Vias: Simplicity in design and manufacturing process
    Finished Board Thickness: 1.8mm, providing durability and structural integrity
    Finished Copper Weight: 1oz (1.4 mils) on outer layers, guaranteeing optimal conductivity
    Via Plating Thickness: 20 μm, ensuring reliable electrical connections
    Surface Finish: HASL, providing excellent solderability and protection against oxidation
    Top Silkscreen: White, facilitating component placement and identification
    Bottom Silkscreen: Not applicable
    Top Solder Mask: Blue, safeguarding copper traces and preventing solder bridges

    Bottom Solder Mask: Blue, protecting copper traces on the bottom layer
    100% Electrical Test: Each PCB undergoes a comprehensive electrical test before shipping, ensuring functionality and quality.


    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23
    2.5 GHz/23
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/-55to288IPC-TM-650 2.4.41
    Tg>280 TMAAIPC-TM-650 2.4.24.3
    Td425 TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50
    ASTM D 570
    Density1.79gm/cm323ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes


    PCB Statistics:

    The Hybrid PCB incorporates a total of 127 components and features 413 pads for component connections. Out of these pads, 216 are dedicated to thru-hole components, while the remaining 197 pads are for surface mount technology (SMT) components on the top layer. There are no SMT pads on the bottom layer. The PCB includes 175 vias to establish connections between different layers. A total of 12 nets represent the interconnected paths between components, ensuring proper signal flow and functionality.


    Artwork Supplied: Gerber RS-274-X


    Quality Standard: Our Hybrid PCB adheres to IPC-Class-2 quality standards, ensuring high reliability and performance.


    Availability: Our Hybrid PCB is available worldwide and can cater to diverse industries and applications.


    Typical Applications:
    - Telecommunications
    - Radar systems, satellite communications, avionics
    - Vehicle communication modules
    - Patient monitoring systems
    - Industrial automation systems
    - Spectrum analyzers, network analyzers, and signal generators


    6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit

    Quality 6-layer Hybrid PCB RO4003C High Tg And FR4 HASL 2.24mm Finished Circuit for sale
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