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5 Years
When creating printed circuit boards (PCBs), several factors need to be considered, such as the choice of materials, construction details, and stackup configuration. In this article, we'll provide a comprehensive overview of these elements for a specific PCB.
The PCB material used is Rogers RO4350B hydrocarbon ceramic laminates. This material is known for its high frequency performance, low loss, and lead-free composition, making it more environmentally friendly. It has a dielectric constant of 3.48 and a dissipation factor of 0.0037 at 10 GHz. The material can operate within a temperature range of -40℃ to +85℃.
The stackup configuration for this PCB includes two layers of base copper, each with a thickness of 17um. The dielectric material used is RO4350B, with a thickness of 60mil. The base copper layers are sandwiched between the dielectric layers, resulting in a finished board thickness of 1.6mm and a finished Cu weight of 1 oz (1.4 mils) for all layers. The via plating thickness is 1 mil, and the surface finish is ENIG. The PCB does not have any top or bottom silkscreen and no silkscreen on the solder pads.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Regarding construction details, the PCB dimensions are 76.00mm x 76.00mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 6/6 mils, and the minimum hole size is 0.45mm. No blind or buried vias are included in this design. The PCB contains 50 components, 73 pads, 26 thru-hole pads, 47 top SMT pads, and 0 bottom SMT pads, with 71 vias and 9 nets. The PCB has undergone 100% electrical testing to ensure its quality.
This PCB does not include impedance matching, with a tolerance of +/- 10%.
For any technical inquiries or further information, please do not hesitate to contact Ivy at sales10@bichengpcb.com.
A Comprehensive Guide to PCB Material, Stackup, and Construction Details
Properties of RO4350B PCB
Dielectric Constant: One of the key features of RO4350B is its dielectric constant, which is 3.48±0.05 for the process and 3.66 for the design. This makes it ideal for high-frequency applications that require low signal loss.
Dissipation Factor: RO4350B has a low dissipation factor (tan δ) of 0.0037 at 10 GHz/23℃ and 0.0031 at 2.5 GHz/23℃, making it an excellent choice for high-frequency applications that require low signal loss.
Thermal Coefficient of ε: RO4350B has a thermal coefficient of ε of +50 ppm/℃, making it more stable and reliable over a wide range of temperatures.
Volume and Surface Resistivity: The volume resistivity of RO4350B is 1.2 x 10^10 MΩ.cm (COND A), and the surface resistivity is 5.7 x 10^9 MΩ (COND A). These values are important for high-frequency applications that require excellent electrical insulation properties.
Electrical Strength: RO4350B has an excellent electrical strength of 31.2 Kv/mm (780 v/mil) at 0.51mm (0.020"), making it ideal for high-frequency applications that require high voltage insulation.
Tensile and Flexural Strength: RO4350B has a high tensile modulus of 16,767 MPa in the X direction and 14,153 MPa in the Y direction, as well as a tensile strength of 203 MPa (29.5 ksi) in the X direction and 130 MPa (18.9 ksi) in the Y direction. The flexural strength is also high at 255 MPa (37 kpsi), making it a durable and reliable material for high-frequency applications.
Coefficient of Thermal Expansion: RO4350B has a low coefficient of thermal expansion in the X and Y directions, which is important for high-frequency applications that require stable and reliable performance over a wide range of temperatures.
Tg and Td: RO4350B has a high glass transition temperature (Tg) of >280℃ TMA (A) and a decomposition temperature (Td) of 390℃ TGA. This makes it ideal for high-temperature applications.
Thermal Conductivity: RO4350B has a high thermal conductivity of 0.69 W/M/oK at 80℃, making it an excellent choice for high-frequency applications that require efficient heat dissipation.
Moisture Absorption: RO4350B has a low moisture absorption rate of 0.06% after 48 hours of immersion in water at 50℃, which is important for high-frequency applications that require reliable performance in humid environments.
Density: RO4350B has a density of 1.86 gm/cm3 at 23℃, which is important for high-frequency applications that require lightweight materials.
Copper Peel Strength: RO4350B has a high copper peel strength of 0.88 N/mm (5.0 pli), making it an ideal choice for high-frequency applications that require strong adhesion between the copper and substrate.
Flammability: RO4350B is rated (3)V-0 for flammability, making it a safe material for high-frequency applications.
Lead-free Process Compatible: RO4350B is lead-free process compatible, making it an environmentally friendly choice for high-frequency PCBs.
In conclusion, RO4350B is a high-performance material that is ideal for high-frequency PCBs. Its low signal loss, low dissipation factor, excellent electrical insulation properties, high voltage insulation, and high-temperature performance make it an excellent choice for a wide range of high-frequency applications. If you're looking for a reliable and durable material for your next high-frequency PCB, consider RO4350B.
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