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2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm

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2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm

It's happy to introduce our newly shipped 2-layer rigid printed circuit board (PCB) made from RT/duroid 6035HTC PTFE Ceramic, which features top-quality performance. Constructed using a lead-free process, this PCB is capable of operating within a temperature range of -40℃ to +85℃, making it suitable for various applications.


The 2-layer rigid PCB has a measurement of 132mm x 101mm with a minimum trace/space of 9/9 mils and a minimum hole size of 0.3mm. The board has no blind or buried vias and has a finished board thickness of 0.6mm with a finished copper weight of 1.5 oz (2.1 mils) all layers. The via plating thickness is 1 mil and the surface finish is immersion silver. The solder pads do not have any silkscreen, and the board has undergone 100% electrical testing.


The PCB consists of 35 components, 90 total pads, and 26 thru-hole pads. It also has 64 top SMT pads, 0 bottom SMT pads, 46 vias, and 12 nets.


The artwork supplied is Gerber RS-274-X, and technical support is available through contacting Ivy at sales10@bichengpcb.com.


2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm


Why should use RT/duroid 6035 HTC PCB?
When it comes to selecting the right PCB material for high-performance applications, RT/duroid 6035HTC PTFE Ceramic is an excellent choice. This hydrocarbon/ceramic-based material boasts outstanding properties and characteristics, making it the ideal choice for high-frequency and high-temperature applications.


PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44W/m/k80℃ASTM C518
Density2.2gm/cm323℃ASTM D792
Copper Peel Stength7.9pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-Free Process CompatibleYes

Properties and Characteristics of RT/duroid 6035HTC Material:
RT/duroid 6035HTC material features a dielectric constant of 3.50±0.05 and a low dissipation factor of 0.0013, making it an optimal choice for high-frequency applications. This material also exhibits good thermal conductivity, electrical strength, and mechanical properties, enabling it to withstand high temperatures and harsh environments. Additionally, RT/duroid 6035HTC material is lead-free process compatible, making it a more environmentally friendly option.


Advantages of RT/duroid 6035HTC Material in High-Performance Applications:
RT/duroid 6035HTC material offers several advantages for high-performance PCB designs, including improved signal integrity, reduced loss, and enhanced performance. This material also provides greater design flexibility, allowing for a wide range of applications, such as aerospace, telecommunications, and medical devices. Additionally, RT/duroid 6035HTC material is highly resistant to moisture absorption, ensuring long-lasting performance.


Applications of RT/duroid 6035HTC PCB Material:
RT/duroid 6035HTC material is widely used in high-performance applications, including power amplifiers, satellite communication systems, and medical devices. Its excellent thermal stability and resistance to moisture absorption make it an ideal choice for high-temperature and harsh environments.


Understanding the Dielectric Constant and Dissipation Factor of RT/duroid 6035HTC:
The dielectric constant and dissipation factor are essential properties of RT/duroid 6035HTC material that affect its performance in high-frequency applications. A low dielectric constant and dissipation factor ensure optimal signal transmission and reduced signal loss, making RT/duroid 6035HTC material an ideal choice for high-frequency applications.


Thermal Stability and Coefficient of Thermal Expansion of RT/duroid 6035HTC:
RT/duroid 6035HTC material exhibits excellent thermal stability, with a thermal coefficient of ε of -66 ppm/℃. Its low coefficient of thermal expansion of 19 ppm/℃ ensures minimal dimensional changes due to temperature variations. This makes it an ideal choice for high-temperature applications.


Copper Peel Strength and Flammability of RT/duroid 6035HTC PCBs:
RT/duroid 6035HTC material exhibits excellent copper peel strength, with a value of 7.9 pli. This ensures reliable and long-lasting performance. Additionally, it has a flammability rating of V-0, making it a safe choice for high-performance applications.


Choosing the Right Supplier for Your RT/duroid 6035HTC PCBs:
Selecting the right provider is crucial for designing high-quality PCBs with RT/duroid 6035HTC material. A reliable supplier can provide technical support, offer guidance throughout the design process, and ensure the highest quality and performance of the final product.


In conclusion, RT/duroid 6035HTC PTFE Ceramic PCB material offers outstanding properties and characteristics, making it an ideal choice for high-performance applications. Its excellent thermal stability, low moisture absorption, and lead-free process compatibility make it a more environmentally friendly option. By selecting the right supplier and carefully considering design factors, you can unlock the full potential of RT/duroid 6035HTC material and achieve optimal performance in your PCB project.

Quality 2 Layer Rigid Printed RF Microwave PCB RT / Duroid 6035HTC 0.6mm for sale
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