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| Brand Name : | Bicheng |
| Model Number : | BIC-173.V1.0 |
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M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Dear friends,
Today, I am going to talk about a type of high speed low loss multilayer PCB: M6 R-5775 PCB.
Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.
Part Numbers
Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670
They Features low Dk = 3.7 (@ 1GHz), low Df = 0.002 (@ 1GHz), excellent through-hole reliability (5x better than our conventional high Tg FR4 material), lead-free, ROHS-compliant soldering, high heat resistance. M6 also provides excellent high-density interconnect (HDI) and thermal performance.
Our PCB Capabilities (Megtron 6)
| PCB Material: | Low DK Glass Cloth |
| Designation: | Laminate R-5775(G), Prepreg R-5670(G) |
| Dielectric constant: | 3.61 at 10GHz |
| Dissipation Factor | 0.004 at 10GHz |
| Layer count: | Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Main Applications
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment,
Measuring instrument,
Super computer,
Typical Value of R-5775
| Property | Units | Test Method | Condition | Typical Value | ||
| THERMAL | Glass Transition Temp ( Tg ) | C | DSC | As received | 185 | |
| DMA | As received | 210 | ||||
| Thermal Decomposition Temp | C | TGA | As received | 410 | ||
| Time to Delam (T288) | Without Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | |
| With Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | ||
| CTE : α1 | X - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | |
| Y - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | ||
| Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 45 | ||
| CTE : α2 | Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | > Tg 260 | 260 | |
| ELECTRICAL | Volume Resistivity | MΩ - cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 109 | |
| Surface Resistivity | MΩ | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 108 | ||
| Dielectric Constant ( Dk ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.71 | |
| @ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 3.61 | ||
| Dissipation Factor ( Df ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 0.002 | |
| @ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 0.004 | ||
| PHYSICAL | Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Peel Strength | 1oz ( H-VLP ) | kN / m | IPC TM-650 2.4.8 | As Received 0.8 | 0.8 | |
| Flammability | / | UL | C-48/23/50 | 94V-0 | ||
Megtron 6 Material List in stock (as of September 2021)
| Item | Thickness (mil) | Thickness(mm) | Structure | Copper weight(oz) | Type of copper |
| R5775G | 2.0 | 0.050 | 1035*1 | H/H | HVLP |
| R5775G | 2.6 | 0.065 | 1080*1 | H/H | HVLP |
| R5775G | 3.0 | 0.075 | 1078*1 | 1.0/1.0 | RTF |
| R5775G | 3.0 | 0.075 | 1078*1 | H/H | RTF |
| R5775G | 3.0 | 0.075 | 1078*1 | 1.0/1.0 | HVLP |
| R5775G | 3.0 | 0.075 | 1078*1 | H/H | HVLP |
| R5775G | 3.9 | 0.100 | 3313*1 | H/H | RTF |
| R5775G | 3.9 | 0.100 | 3313*1 | 1.0/1.0 | RTF |
| R5775G | 5.9 | 0.150 | 1080*2 | 2.0/2.0 | RTF |
| R5775G | 9.8 | 0.250 | 2116*2 | H/H | RTF |
We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.
Thanks for your reading.
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