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RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon

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    Buy cheap RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon from wholesalers
     
    Buy cheap RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon from wholesalers
    • Buy cheap RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon from wholesalers
    • Buy cheap RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon from wholesalers
    • Buy cheap RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon from wholesalers

    RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon

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    Brand Name : Bicheng
    Model Number : BIC-185.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon


    RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    General Description

    RO4533 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.


    It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.


    Features and Benefits

    1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use

    2. Thermoset resin system: Compatible with standard PCB fabrication

    3. Excellent dimensional stability: Greater yield on larger panels sizes

    4. Uniform mechanical properties: Maintains mechanical form during handling

    5. High thermal conductivity: Improved power handling


    Typical Applications:

    1. Cellular infrastructure base station antennas

    2. WiMAX antenna networks


    RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon


    Our PCB Capability (RO4533)

    PCB Material:Ceramic-filled, Glass-reinforced Hydrocarbon
    Designation:RO4533
    Dielectric constant:3.3
    Dissipation Factor0.0025 10GHz
    Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

    RO4533 Typical Values

    PropertyRO4533DirectionUnitsConditionTest Method
    Dielectric Constant, er Process3.3 ± 0.08Z-10 GHz/23 2.5 GHzIPC-TM-650,2.5.5.5
    Dissipation Factor0.002Z-2.5 GHz/23IPC-TM-650, 2.5.5.5
    0.002510 GHz/23
    PIM (Typical)-157-dBcReflected 43 dBm swept tonesSummitek 1900b PIM Analyzer
    Dielectric Strength>500ZV/mil0.51 mmIPC-TM-650, 2.5.6.2
    Dimensional Stability<0.2X,Ymm/m (mils/inch)after etchIPC-TM-650, 2.4.39A
    Coefficient of Thermal Expansion13Xppm/-55 to 288IPC-TM-650, 2.4.41
    11Y
    37Z
    Thermal Conductivity0.6-W/(m.K)80ASTM C518
    Moisture Absorption0.02-%D48/50IPC-TM-650, 2.6.2.1 ASTM D570
    Tg>280- TMAAIPC-TM-650, 2.4.24.3
    Density1.8-gm/cm3-ASTM D792
    Copper Peel Strength6.9 (1.2)-lbs/in (N/mm)1 oz. EDC post solder floatIPC-TM-650, 2.4.8
    FlammabilityNON FR---UL 94
    Lead-Free Process CompatibleYes----

    RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon


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