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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

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    Buy cheap Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin from wholesalers
     
    Buy cheap Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin from wholesalers
    • Buy cheap Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin from wholesalers
    • Buy cheap Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin from wholesalers
    • Buy cheap Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin from wholesalers

    Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-187.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin


    Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    General Description

    RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.


    As a cost-effective replacement for more established PTFE antenna technology, it enables our designers to balance the cost and performance of the antennas. The resin systems of RO4534 dielectric materials are created to offer the appropriate antenna performance-related features. In both the X and Y directions, the coefficients of thermal expansion (CTEs) are comparable to those of copper. The printed circuit board antenna is less stressed because to a good CTE fit.


    Features and Benefits

    1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use

    2. Thermoset resin system: Compatible with standard PCB fabrication

    3. Excellent dimensional stability: Greater yield on larger panels sizes

    4. Uniform mechanical properties: Maintains mechanical form during handling

    5. High thermal conductivity: Improved power handling


    Typical Applications:

    1. Cellular infrastructure base station antennas

    2. WiMAX antenna networks


    Our PCB Capability (RO4534)

    PCB Material:Ceramic-filled, Glass-reinforced Hydrocarbon
    Designation:RO4534
    Dielectric constant:3.4
    Dissipation Factor0.0027 10GHz
    Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

    RO4534 Typical Values

    PropertyRO4534DirectionUnitsConditionTest Method
    Dielectric Constant, er Process3.4 ± 0.08Z-10 GHz/23 2.5 GHzIPC-TM-650,2.5.5.5
    Dissipation Factor0.0022Z-2.5 GHz/23IPC-TM-650, 2.5.5.5
    0.002710 GHz/23
    PIM (Typical)-157-dBcReflected 43 dBm swept tonesSummitek 1900b PIM Analyzer
    Dielectric Strength>500ZV/mil0.51 mmIPC-TM-650, 2.5.6.2
    Dimensional Stability<0.3X,Ymm/m (mils/inch)after etchIPC-TM-650, 2.4.39A
    Coefficient of Thermal Expansion11Xppm/-55 to 288IPC-TM-650, 2.4.41
    14Y
    46Z
    Thermal Conductivity0.6-W/(m.K)80ASTM C518
    Moisture Absorption0.06-%D48/50IPC-TM-650, 2.6.2.1 ASTM D570
    Tg>280- TMAAIPC-TM-650, 2.4.24.3
    Density1.8-gm/cm3-ASTM D792
    Copper Peel Strength6.3 (1.1)-lbs/in (N/mm)1 oz. EDC post solder floatIPC-TM-650, 2.4.8
    FlammabilityNON FR---UL 94
    Lead-Free Process CompatibleYes----

    Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin


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