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Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication

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    Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers
     
    Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers
    • Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers
    • Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers
    • Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers
    • Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers
    • Buy cheap Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication from wholesalers

    Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-103.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication


    Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold

    (PCB's are custom-made products, the picture and parameters shown are just for reference)


    Rogers TMM4 thermoset microwave material is ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability stripline and microstrip applications. It's available with dielectric constant at 4.70. The electrical and mechanical properties of TMM4 combine many of the benefits of both ceramic and traditional PTFE microwave circuit materials, without requiring the specialized production techniques. It does not require a sodium napthanate treatment prior to electroless plating.


    TMM4 has an exceptionally low thermal coefficient of dielectric constant, typically less than 30 PPM/°C. The material’s isotropic coefficient of thermal expansion, very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic materials, facilitating heat removal.


    TMM4 is based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


    Our PCB Capability (TMM4)

    PCB Material:Composite of Ceramic, hydrocarbon and thermoset polymer
    Designator:TMM4
    Dielectric constant:4.5 ±0.045 (process); 4.7 (design)
    Layer count:1 Layer, 2 Layer
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

    Typical Applications

    Chip testers

    Dielectric polarizers and lenses

    Filters and coupler

    Global Positioning Systems Antennas

    Patch Antennas

    Power amplifiers and combiners

    RF and microwave circuitry

    Satellite communication systems


    Data Sheet of TMM4

    PropertyTMM4DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess4.5±0.045Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign4.7--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant+15-ppm/°K-55-125IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity6 x 108-Mohm.cm-ASTM D257
    Surface Resistivity1 x 109-Mohm-ASTM D257
    Electrical Strength(dielectric strength)371ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425TGA-ASTM D3850
    Coefficient of Thermal Expansion - x16Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y16Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z21Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.7ZW/m/K80 ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)15.91X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.76X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.07-%D/24/23ASTM D570
    3.18mm (0.125")0.18
    Specific Gravity2.07--AASTM D792
    Specific Heat Capacity0.83-J/g/KACalculated
    Lead-Free Process CompatibleYES----

    Rogers TMM4 Microwave Pcb With Immersion Gold For Satellite Communication


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