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Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

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    Buy cheap Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers from wholesalers
     
    Buy cheap Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers from wholesalers
    • Buy cheap Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers from wholesalers
    • Buy cheap Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers from wholesalers
    • Buy cheap Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers from wholesalers

    Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

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    Brand Name : Bicheng
    Model Number : BIC-050.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers


    Rogers Microwave PCB Made on RO3010 50mil 1.270mm DK10.2 With Immersion Gold for Power Amplifiers and Antennas

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers RO3010 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3010 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


    The typical applications are cellular telecommunications systems, direct broadcast satellites, patch antenna for wireless communications, power backplanes etc.


    PCB Specifications

    PCB SIZE75 x 80 mm = 1 PCS
    BOARD TYPEHigh Frequency PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsNO
    LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
    RO3010 1.270mm
    copper ------- 18um(0.5 oz)+plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:5.8mil/5.4mil
    Minimum / Maximum Holes:0.4mm / 0.6mm
    Number of Different Holes:1
    Number of Drill Holes:4
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO3010 1.270mm
    Final foil external:1oz
    Final foil internal:0oz
    Final height of PCB:1.4mm ± 10%
    PLATING AND COATING
    Surface FinishImmersion Gold
    Solder Mask Apply To:TOP
    Solder Mask Color:Green
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting, V-cut
    MARKING
    Side of Component LegendTOP
    Colour of Component LegendWhite
    Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
    VIAPlated through hole(PTH)
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers


    Data Sheet of Rogers 3010 (RO3010)

    RO3010 Typical Value
    PropertyRO3010DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess10.2±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign11.2Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0022Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-395Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
    Dimensional Stability0.35
    0.31
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity105COND AIPC 2.5.17.1
    Tensile Modulus1902
    1934
    X
    Y
    MPa23ASTM D 638
    Moisture Absorption0.05%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.8j/g/kCalculated
    Thermal Conductivity0.95W/M/K50ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288
    )
    13
    11
    16
    X
    Y
    Z
    ppm/23/50% RHIPC-TM-650 2.4.4.1
    Td500 TGAASTM D 3850
    Density2.8gm/cm323ASTM D 792
    Copper Peel Stength9.4Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    Quality Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers for sale
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