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Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0

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    Buy cheap Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0 from wholesalers
     
    Buy cheap Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0 from wholesalers
    • Buy cheap Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0 from wholesalers
    • Buy cheap Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0 from wholesalers

    Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0

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    Brand Name : Bicheng
    Model Number : BIC-060.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    Immersion Gold RO4730G3 60mil Rogers PCB Board 1.524mm DK3.0


    Rogers High Frequency PCB Built on RO4730G3 60mil 1.524mm DK3.0 With Immersion Gold for Cellular Base Station Antennas

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.


    RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.


    Typical application is cellular base station antennas.


    General description

    This is a type of double sided RF PCB built on 1.524mm (60mil) RO4730G3 for the application of Cellular Base Station Antenna PCB.


    Basic specifications

    Base material: RO4730G3 60mil (1.524mm)

    Dielectric constant: 3.0+/-0.05

    Layer count: 2 layers

    Type: Through holes

    Format: 110mm x 95mm = 1 type = 1 piece

    Surface finish: Immersion gold

    Copper weight: Outer layer 35 μm

    Solder mask | Legend: Green | White

    Final PCB height: 1.6 mm

    Standard: IPC 6012 Class 2

    Packing: 20 pieces are packed for shipment.

    Lead time: 7 working days

    Shelf life: 6 months


    Data Sheet of Rogers 4730 (RO4730G3)

    RO4730G3 Typical Value
    PropertyRO4730G3DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.0±0.5Z10 GHz 23IPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign2.98Z1.7 GHz to 5 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0028Z10 GHz 23IPC-TM-650 2.5.5.5
    2.5 GHz
    Thermal Coefficient of ε+34Zppm/-50 to 150IPC-TM-650 2.5.5.5
    Dimensional Stability<0.4X, Ymm/mafter etech +E2/150 IPC-TM-650 2.4.39A
    Volume Resistivity (0.030")9 X 107MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity (0.030")7.2 X 105COND AIPC-TM-650 2.5.17.1
    PIM-165dBc50 ohm 0.060"43 dBm 1900 MHz
    Electrical Strength (0.030")730ZV/milIPC-TM-650 2.5.6.2
    Flexural Strength MD181 (26.3)Mpa (kpsi)RTASTM D790
    CMD139 (20.2)
    Moisure Absorption0.093-%48/50IPC-TM-650 2.6.2.1 ASTM D570
    Thermal Conductivity0.45ZW/mK50ASTM D5470
    Coefficient of Thermal Expansion15.9
    14.4
    35.2
    X
    Y
    Z
    ppm/-50 to 288IPC-TM-650 2.4.4.1
    Tg>280IPC-TM-650 2.4.24
    Td411ASTM D3850
    Density1.58gm/cm3ASTM D792
    Copper Peel Stength4.1pli1oz,LoPro EDCIPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

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