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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
5 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Model Number : | BIC-8.V1.0 |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
Rogers 4350 PCB 10 mil double sided High Frequency Circuit Boards
Rogers 4350 high frequency PCBs are made of hydrocarbon ceramic laminates which are designed to offer superior high frequency performance and low cost high volume applications. They are not PTFE that can be manufactured using standard epoxy/glass (FR-4) processes.
It has dielectric constant of 3.48,dissipation factor of 0.0037 at 10 GHz. Low dielectric tolerance and low loss allows applications with higher operating frequencies.
The expansion coefficient of roges 4350 circuits is similar to that of copper that allows the board exhibiting excellent dimensional stability. And it has a Tg of >280°C (536°F), so the expansion characteristics remain stable over the entire range of circuit processing temperatures.
Rogers RO4350B PCBs have been used sucessfullly more than 10 years in high power amplifiers, microwave power amplifiers, celluar base station antennas etc.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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