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We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
5 Years
| Ask Lasest Price | |
| Brand Name : | Bicheng |
| Model Number : | BIC-009.V1.0 |
| Certification : | UL, ISO9001, IATF16949 |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T |
| Supply Ability : | 5000PCS per month |
| Delivery Time : | 8-9 working days |
Rogers 4003 High Frequency PCB Double Sided RF PCB for Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Introduction of RO4003C material
The Rogers Corporation manufactures woven glass reinforced hydrocarbon ceramic-filled laminates known as RO4003C high frequency materials. It can be manufactured using materials made of epoxy resin and shares the same electrical characteristics as PTFE/woven glass. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. Designers of RF microwave circuits, matching networks, and controlled impedance transmission lines can rely on the features of RO4003C material. Higher operating frequencies prevent the use of standard circuit board materials in many applications, while low dielectric loss enables RO4003C material to be employed in those applications. The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material. The thermal coefficient of expansion (CTE) of the RO4003C material offers the PCB designers a number of significant advantages. Due to its identical expansion coefficient to that of copper, RO4003C exhibits high dimensional stability, a quality required for the creation of mixed dielectric multi-layer boards. Even in applications that need extreme thermal shock, the RO4003C's low Z-axis CTE ensures dependable plated through-hole quality. The expansion characteristics of the RO4003C material are steady over the whole temperature range of PCB processing thanks to its Tg of >280C.
PCB Specifications
| PCB SIZE | 58 x 110mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1 oz)+plate TOP layer |
| RO4003C 0.203mm | |
| copper ------- 35um(1oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6 mil / 11 mil |
| Minimum / Maximum Holes: | 0.4 mm / 0.4 mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 3 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4003C Tg280℃, er<3.48, Rogers Corp. |
| Final foil external: | 1.5 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold, 19.5% |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | N/A |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data Sheet of Rogers 4003C (RO4003C)
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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