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Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating

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    Buy cheap Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating from wholesalers
     
    Buy cheap Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating from wholesalers
    • Buy cheap Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating from wholesalers
    • Buy cheap Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating from wholesalers
    • Buy cheap Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating from wholesalers

    Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating

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    Brand Name : Bicheng
    Model Number : BIC-099.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating


    Rogers RO3006 High Frequency PCB with 10mil, 25mil and 50mil Thick Coating Immersion Gold, Immersion Tin and Silver, OSP

    (PCB's are custom-made products, the picture and parameters shown are just for reference)


    Hello everyone,

    Today we’re talk about RO3006 high frequency PCBs.


    RO3006 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.


    Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating


    More features and applications are as follows:


    Firstly, excellent mechanical properties versus temperature, it’s reliable for stripline and multi-layer board constructions.


    Secondly, uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.


    Thirdly, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.


    PCB Capability
    PCB Material:Ceramic-filled PTFE composite
    Designation:RO3006
    Dielectric constant:6.15 ±0.3 (process)
    6.5 (design)
    Layer count:2 Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 25mil (0.635mm)
    50mil (1.27mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..
      

    RO3006 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.3mm to 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.


    Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating


    Typical applications are automotive radar applications, GPS antennas, Power amplifiers and antennas, patch antennas for wireless communicationS, direct broadcast satellite etc.


    Rogers 3006 PCB Board 10mil 25mil 50mil Thick Coating


    The basic colour of RO3006 PCB is white.


    The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.


    The basic colour of RO3006 PCB is white.


    The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.


    Should you have any questions, please feel free to contact us.


    Thank you for your reading.


    Appendix: Data Sheet RO3006

    RO3006 Typical Value
    PropertyRO3006DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess6.15±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign6.5Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.002Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-262Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.27
    0.15
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity105COND AIPC 2.5.17.1
    Tensile Modulus1498
    1293
    X
    Y
    MPa23℃ASTM D 638
    Moisture Absorption0.02%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.86j/g/kCalculated
    Thermal Conductivity0.79W/M/K50℃ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    17
    17
    24
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500℃ TGAASTM D 3850
    Density2.6gm/cm323℃ASTM D 792
    Copper Peel Stength7.1Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

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