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Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni

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    Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
     
    Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
    • Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
    • Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
    • Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
    • Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
    • Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers
    • Buy cheap Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni from wholesalers

    Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni

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    Brand Name : Bicheng
    Model Number : BIC-294.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni

    Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electronics

    (Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


    General description

    This is a type of flexible printed circuit for the application of Digital Electronics. It’s a 4 layer FPC at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffener is applied on the two ends.


    Parameter and data sheet

    Size of Flexible PCB60.87 X 130.42mm
    Number of Layers4
    Board TypeFlexible PCB
    Board Thickness0.20mm
    Board MaterialPolyimide 25µm
    Board Material SupplierITEQ
    Tg Value of Board Material60℃
    PTH Cu thickness≥20 µm
    Inner Iayer Cu thicknes35 µm
    Surface Cu thickness35 µm
    Coverlay ColourYellow
    Number of Coverlay2
    Thickness of Coverlay25 µm
    Stiffener MaterialFR-4
    Stiffener Thickness1.0mm
    Type of Silkscreen InkIJR-4000 MW300
    Supplier of SilkscreenTAIYO
    Color of SilkscreenWhite
    Number of Silkscreen1
    Peeling test of CoverlayNo peelable
    Legend Adhesion3M 90℃ No peeling after Min. 3 times test
    Surface FinishImmersion Gold
    Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
    RoHS RequiredYes
    Famability94-V0
    Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
    Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
    Function100% Pass electrical test
    WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2

    Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni


    Features and benefits

    Excellent flexibility

    Reducing the volume

    Weight reduction

    Consistency of assembly

    Increased reliability

    Controllability of electrical parameter design

    The end can be whole soldered

    Continuity of processing

    Small quantity order is accepted

    Eligible products rate of first production: >95%


    Applications

    Mobile phone built-in antenna FPC, FFC for industrial control equipment, medical equipment controller


    Brief Introduction of FPC

    Flexible Printed Circuit Board (FPC) is referred to as "soft board". In the industry, FPC is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, folded. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera and other fields or products.


    FPC also has the advantages of good heat dissipation, solderability, easy mounting and low cost.


    Flexible printed circuit board has one layer, two layers and multilayer board. The base material is polyimide clad laminate. This kind of material has high heat resistance and good dimensional stability. It is the final product through pressing with the coating film which has both mechanical protection and good electrical insulation. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metallized to realize the electrical connection of inner and outer layers.


    The function of flexible circuit board can be divided into four kinds, namely, lead line, printed circuit, connector and multifunction integrated system, which cover computer, computer peripheral auxiliary system, consumer household electrical appliance and automobile, etc.

    Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
    Quality Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni for sale
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