Sign In | Join Free | My himfr.com
himfr.com

Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Verified Supplier

5 Years

Home > HDI PCB Board >

Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board from wholesalers
     
    Buy cheap Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board from wholesalers
    • Buy cheap Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board from wholesalers
    • Buy cheap Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board from wholesalers
    • Buy cheap Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board from wholesalers
    • Buy cheap Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board from wholesalers

    Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-452.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

    Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board

    (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)


    1.1 General description

    This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of mobile phone with blind via technology. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.


    1.2 Features and Benefits

    1.2.1 Middle Tg FR-4 Shows low Z-CTE and excellent through hole reliability;

    1.2.2 Immersion gold has high solderability, no stressing and less contamination;

    1.2.3 Multilayer shortened connection between electronic components;

    1.2.4 16000㎡ workshop and 8000 types of PCB's per month;

    1.2.5 Delivery on time: >98%

    1.2.6 No minimum order quantity. 1 piece is available;


    Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board


    1.3 Applications

    GPS Tracking Syste

    Embedded Systems

    Data Acquisition System

    Microcontrollers


    1.4 Parameter and data sheet

    PCB SIZE119 x 80mm=1PCS
    BOARD TYPEMultilayer PCB
    Number of Layers4 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 18um(0.5oz)+plate TOP layer
    Core FR-4 0.61mm
    copper ------- 35um(1oz) MidLayer 1
    Prepreg 0.254mm
    copper ------- 35um(1oz) MidLayer 2
    Core FR-4 0.61mm
    copper ------- 18um(0.5oz)+plate BOT layer
    TECHNOLOGY
    Minimum Trace and Space:4 mil / 4 mil
    Minimum / Maximum Holes:0.3 mm /3.5 mm
    Number of Different Holes:9
    Number of Drill Holes:415
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:FR-4 Tg150℃, er<5.4.IT-158, ITEQ
    Final foil external:1oz
    Final foil internal:1oz
    Final height of PCB:1.6mm ±0.16
    PLATING AND COATING
    Surface FinishImmersion Gold
    Solder Mask Apply To:TOP and Bottom, 12micron Minimum
    Solder Mask Color:Green, PSR-2000 GT600D, Taiyo Supplied.
    Solder Mask Type:LPSM
    CONTOUR/CUTTINGRouting, stamp holes.
    MARKING
    Side of Component LegendTOP and Bottom.
    Colour of Component LegendWhite, S-380W, Taiyo Supplied.
    Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
    VIAPlated through hole(PTH), minimum size 0.3mm. Blind Via Top to Inner layer 1, Bottom to Inner layer 2
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board


    1.5 Composition of Holes

    The blind hole is located on the top and bottom surface of the printed circuit board and has a certain depth for the connection between the surface line and the inner line below. The depth of the hole usually does not exceed a certain ratio (aperture). Buried hole is a connecting hole located in the inner layer of the printed circuit board, which does not extend to the surface of the circuit board.

    The above two kinds of holes are located in the inner layer of the circuit board. The formation of through hole process is used before lamination, and several inner layers may be overlapped done during the formation of the through hole.


    The third is called a through hole, which passes through the entire circuit board. It can be used to interconnect internally or as an installation location hole for components. Because the through hole is easier to realize and the cost is low, it is used in most printed circuit boards instead of the other two. The following mentioned holes, without special instructions, are considered as through holes.


    From the design point of view, a hole is mainly composed of two parts, one is the middle hole (drill hole), the other is the pad area around the hole, see below. The size of these two parts determines the size of the hole. Clearly, in

    high-speed, high-density PCB design, designers always want the holes the smaller the better, so that it can leave more wiring space on the board.


    Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board


    1.6 PCB capability 2022

    ParameterValue
     Layer Counts 1-32
     Substrate MaterialRO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
     Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
     Board Outline Tolerance ±0.0059" (0.15mm)
     PCB Thickness0.0157" - 0.3937" (0.40mm--10.00mm)
    Thickness Tolerance(T≥0.8mm) ±8%
    Thickness Tolerance(t<0.8mm) ±10%
     Insulation Layer Thickness0.00295" - 0.1969" (0.075mm--5.00mm)
     Minimum Track0.003" (0.075mm)
     Minimum Space 0.003" (0.075mm)
     Outer Copper Thickness 35µm--420µm (1oz-12oz)
     Inner Copper Thickness 17µm--350µm (0.5oz - 10oz)
     Drill Hole(Mechanical)0.0059" - 0.25" (0.15mm--6.35mm)
     Finished Hole(Mechanical)0.0039"-0.248" (0.10mm--6.30mm)
    DiameterTolerance(Mechanical)0.00295" (0.075mm)
     Registration (Mechanical)0.00197" (0.05mm)
     Aspect Ratio 12:1
     Solder Mask Type LPI
     Min Soldermask Bridge0.00315" (0.08mm)
     Min Soldermask Clearance0.00197" (0.05mm)
     Plug via Diameter0.0098" - 0.0236" (0.25mm--0.60mm)
    Impedance Control Tolerance ±10%
     Surface FinishHASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

    Quality Blind Via PCB Built on Tg150℃ FR-4 With Immersion Gold 4-Layer FR-4 Circuit Board for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)