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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

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    Buy cheap 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB from wholesalers
     
    Buy cheap 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB from wholesalers
    • Buy cheap 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB from wholesalers
    • Buy cheap 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB from wholesalers
    • Buy cheap 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB from wholesalers
    • Buy cheap 1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB from wholesalers

    1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-470.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

    Immersion Silver PCB On 1.0mm Epoxy Glass ITEQ FR-4 2 Layer Circuit Board for USB Charger
    1.1 General description
    This is a type of 2 layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of USB charger. It's 1.0 mm thick with white silkscreen(Taiyo) on green solder mask (Nanya) and immersion silver on pads. The base material is from Taiwan ITEQ supplying 4 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30 panels are packed for shipment.
    1.2 Features and benifits
    Outstanding thermal resistance and suitable for lead-free process
    Can be horizontal operation and has high efficiency
    AOI inspection
    Meeting your PCB needs from prototype to mass production.
    12 hours quotation
    Prototype PCB capability
    1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
    1.3 Application
    Router Wireless
    Bluetooth Adapter For PC
    Motor Controller
    GSM Tracking
    Modem HSDPA
    1.4 Parameter and data sheet
    PCB SIZE120 x 79mm=4PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layes
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 17.8um(0.5oz)+PLATE
    FR-4 0.8mm
    copper ------- 17.8um(0.5oz)+PLATE
    TECHNOLOGY
    Minimum Trace and Space:4mil/4mil
    Minimum / Maximum Holes:0.5/3.8mm
    Number of Different Holes:4
    Number of Drill Holes:135
    Number of Milled Slots:1
    Number of Internal Cutouts:0
    Impedance Controlno
    BOARD MATERIAL
    Glass Epoxy:FR-4, ITEQ IT-180A TG>170
    Final foil external:1oz
    Final foil internal:0oz
    Final height of PCB:1.0mm ±0.1
    PLATING AND COATING
    Surface FinishImmersion Silver, Ag>0.15µm
    Solder Mask Apply To:Top and Bottom, 12micon Minimum.
    Solder Mask Color:Green, LP-4G G-05, Nanya supplied
    Solder Mask Type:LPSM
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendTOP
    Colour of Component LegendWhite, S-380W, Taiyo Supplied.
    Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
    VIAPlated Through Hole(PTH), via tented.
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059" (0.15mm)
    Board plating:0.0030" (0.076mm)
    Drill tolerance:0.002" (0.05mm)
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.
    1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
    1.5 ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS
    PropertyThickness<0.50 mmThickness≧0.50 mmUnitsTest Method
    [0.0197 in][0.0197 in]
    Typical ValueSpecTypical ValueSpecMetricIPC-TM-650
    (English)(or as noted)
    Peel Strength, minimumN/mm2.4.8
    A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil](lb/inch)2.4.8.2
    B. Standard profile copper foil0.88 (5.0)0.70 (4.00)0.88 (5.0)0.70 (4.00)2.4.8.3
    1. After Thermal Stress
    2. At 125°C [257 F]
    3. After Process Solutions1.23 (7.0)0.80 (4.57)1.40 (8.0)1.05 (6.00)
    1.05 (6.0)0.70 (4.00)1.23 (7.0)0.70 (4.00)
    1.05 (6.0)0.55 (3.14)1.23 (7.0)0.80 (4.57)
    Volume Resistivity, minimumMW-cm2.5.17.1
    A. C-96/35/903.0x1010106----
    B. After moisture resistance----3.0x1010104
    C. At elevated temperature E-24/1255.0x10101031.0x1010103
    Surface Resistivity, minimumMW2.5.17.1
    A. C-96/35/903.0x1010104----
    B. After moisture resistance----3.0x1010104
    C. At elevated temperature E-24/1254.0x10101034.0x1010103
    Moisture Absorption, maximum----0.120.8%2.6.2.1
    Dielectric Breakdown, minimum----6040kV2.5.6
    Permittivity (Dk, 50% resin content)5.45.4--
    (Laminate & Laminated Prepreg)
    A. 1MHz4.44.42.5.5.9
    B. 1GHz4.44.4
    C. 2GHz4.24.32.5.5.13
    D. 5GHz4.14.1
    E. 10GHz44.1
    Loss Tangent (Df, 50% resin content)0.0350.035--
    (Laminate & Laminated Prepreg)
    A. 1MHz0.0150.0142.5.5.9
    B. 1GHz0.0150.015
    C. 2GHz0.0150.0152.5.5.13
    D. 5GHz0.0160.016
    E. 10GHz0.0170.016
    Flexural Strength, minimumN/mm22.4.4
    A. Length direction----500-530415(lb/in2)
    ----(72,500-76,850)-60,190
    B. Cross direction----410-440345
    ----(59,450-63,800)-50,140
    Arc Resistance, minimum1256012560s2.5.1
    Thermal Stress 10 s at 288°C [550.4F],minimumRating2.4.13.1
    A. UnetchedPassPass VisualPassPass Visual
    B. EtchedPassPass VisualPassPass Visual
    Electric Strength, minimum4530----kV/mm2.5.6.2
    (Laminate & Laminated Prepreg)
    Flammability,V-0V-0V-0V-0RatingUL94
    (Laminate & Laminated Prepreg)
    Glass Transition Temperature(DSC)175170 minimum175170 minimum˚C2.4.25
    Decomposition Temperature----345340 minimum˚C2.4.24.6
    (5% wt loss)
    X/Y Axis CTE (40℃ to 125℃)----10--13--PPM/˚C2.4.24
    Z-Axis CTE2.4.24
    A. Alpha 1----4560 maximumPPM/˚C
    B. Alpha 2----210300 maximumPPM/˚C
    C. 50 to 260 Degrees C----2.73.0 maximum%
    Thermal Resistance2.4.24.1
    A. T260---->6030 minimumMinutes
    B. T288---->3015 minimumMinutes
    CAF Resistance----PassAABUSPass/Fail2.6.25

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