Immersion Gold PCB Nickel/Gold Plating Circuit Board with BGA and
Via In Pad for Signal Transmission
1.1 General description
This is a type of multilayer PCB built on FR-4 substrate with Tg
135°C for the application of Signal transmission with 12 layer
copper track. It's 2.0 mm thick with white silkscreen(Taiyo) on
green solder mask (Taiyo) and immersion gold on pads. The base
material is from ITEQ supplying single up PCB. They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are
packed for shipment.
1.2 Features and benifits
Lead free assemblies with a maximum reflow temperature of 260℃.
Long storage time ( It can be stored for more than 1 year in vacuum
bag)
Improved the speed of signal transmission
PCB manufacturing on required specifications.
Quick and on-time delivery
UL recognized and RoHS Directive-compliant
Prototype PCB capability
1.3 Applications
Solar Battery Charger
Vehicle Tracker
GPS Receiver
SMS Modem
Multicoupler Antenna
Phone systems
1.4 Parameter and data sheet
| PCB SIZE | 257 x 171.5mm=1PCS=1design |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 12 Layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- TOP 17um(1oz)+plate 25um |
| 130 um prepreg 1080 x 2 |
| copper ------- L02 35um(1oz) |
| 150um core FR-4 |
| copper ------- L03 35um(1oz) |
| 130 um prepreg 1080 x 2 |
| copper ------- L04 35um(1oz) |
| 150um core FR-4 |
| copper ------- L05 35um(1oz) |
| 130 um prepreg 1080 x 2 |
| copper ------- L06 35um(1oz) |
| 150um core FR-4 |
| copper ------- L07 35um(1oz) |
| 130 um prepreg 1080 x 2 |
| copper ------- L08 35um(1oz) |
| 150um core FR-4 |
| copper ------- L09 35um(1oz) |
| 130 um prepreg 1080 x 2 |
| copper ------- L10 35um(1oz) |
| 150um core FR-4 |
| copper ------- L11 35um(1oz) |
| 130 um prepreg 1080 x 2 |
| copper ------- BOT 17um(0.5oz)+plate 25um |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.25 mm / 3.0 mm |
| Number of Different Holes: | 26 |
| Number of Drill Holes: | 4013 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-140, Tg>135℃, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 2.0mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. Vin in pad under BGA package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Advantages of PCB Boards with Electroless Nickel and Immersion
Gold
(1) Flat Surface
The most important feature is that the surface of all pads is
perfectly flat, corresponding to the underlying copper surface,
with all pad and track edges covered by nickel/gold.
(2) Low Defect Rate
An important reason for choosing immersion gold surface protection
is a highly reduced failure rate during assembly and soldering
compared with solder-coated and hot-air leveled boards. It is
especially true of fine line boards with a component pitch of 0.5
mm (20 mils) or less.
(3) Solderability
Solderability is high but the soldering time is a little longer
(about 5 seconds.) compared with wave soldering (3seconds.)
(4) Dimensional Stability
Since the boards are not subjected to temperatures above 90° C
(194° F) during manufacture, the dimensional stability is high.
This is of great importance when screen-printing solder paste on
fine-line SMT boards because a better fit between the stencil and
the pattern is achieved than in the case of solder coated and
hot-air leveled boards.
