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High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

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    Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
     
    Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
    • Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
    • Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
    • Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
    • Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
    • Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers
    • Buy cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold from wholesalers

    High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

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    Brand Name : Bicheng
    Model Number : BIC-477.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

    Via in Pad PCB High Density Multilayer PCB Via Filled Circuit Board with Immersion Gold for GPS Tracking Devices
    1.1 General description
    This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for the application of GPS Tracking Devices. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supplying 1 up single board. Vias with 0.3mm are resin filled and plated flatly (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
    1.2 Features and benifits
    RoHS compliant and suitable for high thermal reliability needs
    Excellent surface planarity for CSP mounted components to reduce failure rate during assembly and soldering.
    Reliability test, insulation resistance test and ionic contamination test
    16000 square meter workshop
    12 hours quotation
    No quality complaint is meant to save money
    High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold
    1.3 Applications
    Inverters
    Router ADSL
    Industrial Computer
    Weather analysis
    1.4 Parameter and data sheet
    Number of Layers6
    Board TypeMulti-layer PCB
    Board size54.99 x 87.50mm=1UP
    Board Thickness1.6mm +/-0.16
    Board MaterialFR-4
    Board Material SupplierITEQ
    Tg Value of Board Material170℃
    PTH Cu thickness≥20 um (See hole wall details)
    Inner Iayer Cu thicknes35 um (1oz)
    Surface Cu thickness35 um (1oz)
    Solder Mask Type and Model No.LPSM, PSR-2000GT600D
    Solder Mask SupplierTAiYO
    Solder Mask ColourGreen
    Number of Solder Masks2
    Thickness of Solder Mask13um
    Type of Silkscreen InkTAIYO, IJR-4000 MW300
    Supplier of SilkscreenTAIYO
    Color of SilkscreenWhite
    Number of Silkscreen1
    Mininum Trace (mil)7 mil
    Minimum Gap(mil)4.9 mil
    Surface FinishImmersion Gold
    RoHS RequiredYes
    Warpage0.25%
    Drill table (mm)
    T11.000
    T23.175
    Thermal Shock TestPass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
    Solderablity TestPass, 255±5℃,5 seconds Wetting Area Least 95%
    Function100% Pass electrical test
    WorkmanshipCompliance with IPC-A-600H & IPC-6012C Class 2
    Drill table (mm)T1: 0.600
    T2: 0.700
    T3:0.800
    T4: 1.000
    T5: 1.100
    T6: 1.250
    T7: 1.850
    T8: 4.000
    T9: 4.325
    High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold
    1.5 Design For Manufacture (1)
    Serial NO.ProcedureItemManufacturing capability
    Large volume (S<100 m²)Middle volume (S<10 m²)Prototype(S<1m²)
    1Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )Min.isolation of layers0.1mm0.1mm0.06mm
    2Min.track and spacing5/5mil(18um)4/4mil(18um)3/3.5mil(18um)
    35/5mil(35um)4/4mil(35um)3/4mil(35um)
    47/9mil(70um)6/8mil(70um)6/7mil(70um)
    59/11mil(105um)8/10mil(105um)8/9mil(105um)
    613/13mil(140um)12/12mil(140um)12/11mil(140um)
    7Min.distance from drill to conductor4 Layer 10mil,6 layer 10mil,8-12 layer 12mil4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
    8Min.width of annular ring on inner layer4 Layer 10mil(35um),≥6 Layer 14mil(35um)4 Layer 8mil(35um),≥6 layer 12mil(35um)4 Layer 6mil(35um),≥6 Layer 10mil(35um)
    9Inner layer isolation ring width(Min)10mil (35um)8mil (35um)6mil (35um)
    10Min.via pad diameter20mil (35um)16mil (35um)16mil (35um)
    11Min. distance from board edge to conductor(no copper exposured)(inner layer)14 mil(35um)12 mil(35um))8 mil(35um)
    12Maximum copper weight(Inner layer and outer layer)3 OZ( 105 um )4 OZ ( 140 um )6 OZ( 210 um )
    13Core with different copper foil on both sides/18/35,35/70 um18/35,35/70 um

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