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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

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Brand Name :	Bicheng
Model Number :	BIC-481.V1.0
Certification :	UL, ISO9001, IATF16949
Price :	USD9.99-99.99
Payment Terms :	T/T
Supply Ability :	5000PCS per month
Delivery Time :	8-9 working days

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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

Multi-layer Printed Circuit Board 8 Layer PCB Board Built on Tg170 FR-4 With Immersion Gold for Wireless Communication.

1.1 General description

This is a type of 8 layer printed circuit board built on FR-4 Tg170 substrate for the application of Wireless Communication. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supply 1 up board per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

1.2 Features and benifits

Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.

High solderability, no stressing of circuit boards and less contamination of PCB surface.

Electrical test and high voltage test

Quick and on-time delivery

Money-saving, Worry-saving and Labor-saving

Free-of-charge PCB prototype test

1.3 Applications

Video Surveillance

Converters

Electrical Converter

Embedded System Applications

Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

1.4 Parameter and data sheet

Number of Layers	8
Board Type	Multilayer PCB
Board size	210.72 x 212.42mm=1UP
Board Thickness	1.60 mm +/-0.16
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	170℃

PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)

Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	14 um

Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1

Mininum Trace (mil)	5.8 mil
Minimum Gap(mil)	5.4 mil

Surface Finish	Immersion Gold
RoHS Required	Yes
Warpage	0.25%
Thermal Shock Test	Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test	Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)
T1	0.450
T2	0.600
T3	0.800
T4	0.900
T5	0.950
T6	1.000
T7	1.250
T8	1.300
T9	1.400
T10	1.600
T11	1.700
T12	2.000
T13	2.550
T14	3.000
T15	3.250
T16	3.500

1.5 Design For Manufacture (5)

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
66	Contour process	Method of contour process	CNC milling, V-CUT, Break-out tap, break-out holes, Punching
67		Minimum router	0.8mm
68		Min.tolerance of contour	±0.15mm	±0.13mm	±0.1mm
69		Min.distance of milling contour(no copper exposure)	12mil	10mil	8mil
70		Angle of V-CUT	20,30,45,60 ±5 degree
71		Degree of symmetry of V-CUT	±6mil	±5mil	±4mil
72		Tolerance of residual thickness of V-CUT	±6mil	±5mil	±4mil
73		Tolerance of Chamfer angle of Gold finger	±5 degree	±5 degree	±5 degree
74		Tolerance of residual thickness of bevel edge of gold finger	±5mil	±5mil	±5mil
75		Min radius of inner corner	0.4mm
76		Min. distance from edge to V-Cut (no copper exposure)	18mil (1.6mm Thick, 20 degree V-groove cutter)	14mil(1.6mm Thick, 20 degree V-groove cutter)	12mil (1.6mm Thick, 20 degree V-groove cutter)
77			20mil (1.6mm Thick, 30 degree V-groove cutter)	18mil (1.6mm Thick, 30 degree V-groove cutter)	16mil (1.6mm Thick, 30 degree V-groove cutter)
78			24mil (1.6mm Thick, 45 degree V-groove cutter)	22mil (1.6mm Thick, 45 degree V-groove cutter)	20mil (1.6mm Thick, 45 degree V-groove cutter)
79			30mil (1.6mm Thick, 60 degree V-groove cutter)	28mil (1.6mm Thick, 60 degree V-groove cutter)	26mil (1.6mm Thick, 60 degree V-groove cutter)

Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board

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