Differential Impedance Controlled PCB Single-End Impedance Circuit
Board 10 Layer PCB Board Satellite systems
1.1 General description
This is a type of multilayer PCB built on FR-4 substrate with Tg
170°C for the application of Satellite systems with 10 layer
copper. It's 1.6 mm thick with white silkscreen(Taiyo) on green
solder mask (Taiyo) and immersion gold on pads. This is also an
impedance controlled PCB with 50 ohm single-end impedance and 97
ohm with differential impedance control. The base material is from
ITEQ supplying 4 up PCBs per panel. They're fabricated per IPC 6012
Class 2 using supplied Gerber data. Each 25 panels are packed for
shipment.
1.2 Features and benifits
Lead free assemblies with a maximum reflow temperature of 260℃
SMT process is resistant to reflow soldering, resistant to rework.
The signal lines form a constant low impedance to the ground
Strict WIP inspection and monitoring as well as working instruction
UL, ISO14001, TS16949 certified
Hassle-free, one-to-one after-sales service
Delivery on time: >98%
1.3 Applications
GPS Tracking Devices
GSM Signal Booster
Automotive dashboards
1.4 Parameter and data sheet
| PCB SIZE | 199 x 170mm=4PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 10 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 0.1016mm (4mil) |
| copper ------- 35um(1oz) Plane GND |
| FR-4 0.127mm (5 mil) |
| copper ------- 18um(0.5 oz) Signal SIG1 |
| Prepreg 0.127 mm (5mil) |
| copper ------- 18um(0.5 oz) Signal SIG2 |
| Prepreg 0.127mm (5 mil) |
| copper ------- 35um(1oz) Plane PWR |
| FR-4 0.330mm (13mil) |
| copper ------- 35um(1oz) Plane GND |
| Prepreg 0.127mm (5 mil) |
| copper ------- 18 um(0.5 oz) Signal SIG3 |
| Prepreg 0.127mm (5 mil) |
| copper ------- 18 um(0.5 oz) Signal SIG4 |
| Prepreg 0.127mm (5 mil) |
| copper ------- 35um(1oz) Plane GND |
| Prepreg 0.1016mm (4mil) |
| copper ------- 35um(1oz) Signal BOT |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.25/4.2mm |
| Number of Different Holes: | 15 |
| Number of Drill Holes: | 850 |
| Number of Milled Slots: | 10 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | YES. Top layer, 7.0 mil trace 50 ohms single end. Layer 3 signal
layer, 4.0/4.0 mil trace-space differential impedance = 91 ohms;
4.0/6.0 mil trace-space differential impedance = 97 ohms. |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (30.1% ) 0.1µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, stamp holes. |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | plated through hole(PTH), minimum via 10 mils. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Impedance PCB- Impedance match
If there is signal transmission in the circuit board, it is
expected to be smoothly transmitted from the sending end to the
receiving end under the condition of minimum energy loss, and the
receiving end can completely absorbs it without any reflection. To
achieve this kind of transmission, the impedance of the circuit
must be equal to the internal impedance of the sending end, which
is called "impedance match."
So when the signal is transmitted in the PCB, the characteristic
impedance of the PCB board must be matched with the electronic
impedance of the head and tail components. Once the impedance value
exceeds the tolerance, the transmitted signal energy will be
reflected, scattered, attenuated or delayed, resulting in
incomplete signal and signal distortion.
Impedance match is one of the design elements when designing
high-speed PCB circuits. However, the impedance value is absolutely
related with wiring mode. For example, whether wiring on the
surface layer or inner layer, the distance from the reference power
layer or ground layer, the width of wiring, the PCB material, etc.
will affect the characteristic impedance of wiring. That is to say,
the impedance value can be determined only after wiring layout,
while the characteristic impedance produced by different PCB
manufacturers is also slightly different. The wiring layout
condition of impedance discontinuity cannot be completely
considered in general simulation software due to the limitation of
the circuit model or the mathematical algorithm used. In this case,
only some temninators, such as series resistors, can be reserved on
the schematic diagram to mitigate the effect of discontinuous
wiring impedance. The method to completely solve the problem is
still trying to avoid the occurrence of impedance discontinuities
when wiring layout.
