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15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

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    Buy cheap 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers from wholesalers
     
    Buy cheap 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers from wholesalers
    • Buy cheap 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers from wholesalers
    • Buy cheap 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers from wholesalers

    15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-148.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers


    Rogers 15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for Chip Testers

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.


    TMM10 laminates' electrical and mechanical characteristics combine many of the advantages of ceramic and conventional PTFE microwave circuit laminates without the need for the specific manufacturing processes typical of these materials.


    The thermal coefficient of dielectric constant of TMM10 laminates is typically less than 30 ppm/°C, which is extremely low. The material can produce high reliability plated through holes with minimal etch shrinkage values thanks to its isotropic coefficients of thermal expansion, which are extremely closely matched to those of copper. Additionally, TMM10 laminates' thermal conductivity is about twice as high as that of conventional PTFE/ceramic laminates, making it easier to remove heat from the system.


    The thermoset resins used in TMM10 laminates prevent them from softening when heated. As a result, there is no need to worry about pad lifting or other issues while wire bonding component leads to circuit traces.


    Some Typical Applications:

    1. Filters and coupler

    2. Power amplifiers and combiners

    3. RF and microwave circuitry


    Our Capabilities (TMM10)

    PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
    Designation:TMM10
    Dielectric constant:9.20 ±0.23
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    Data Sheet of TMM10

    TMM10 Typical Value
    PropertyTMM10DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess9.20±0.23Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign9.8--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.0022Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant-38-ppm/°K-55-125IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity2 x 108-Mohm.cm-ASTM D257
    Surface Resistivity4 x 107-Mohm-ASTM D257
    Electrical Strength(dielectric strength)285ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425TGA-ASTM D3850
    Coefficient of Thermal Expansion - x21Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y21Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z20Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.76ZW/m/K80 ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.0 (0.9)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)13.62X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.79X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.09-%D/24/23ASTM D570
    3.18mm (0.125")0.2
    Specific Gravity2.77--AASTM D792
    Specific Heat Capacity0.74-J/g/KACalculated
    Lead-Free Process CompatibleYES----

    Quality 15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers for sale
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