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Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold

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    Buy cheap Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold from wholesalers
     
    Buy cheap Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold from wholesalers
    • Buy cheap Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold from wholesalers
    • Buy cheap Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold from wholesalers
    • Buy cheap Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold from wholesalers
    • Buy cheap Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold from wholesalers

    Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold

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    Brand Name : Bicheng
    Model Number : BIC-153.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold


    Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers’ TMM10i thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.


    The electrical and mechanical properties of TMM10i laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.


    TMM10i laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10i laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.


    TMM10i laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


    Some Typical Applications:

    1. Chip testers

    2. Dielectric polarizers and lenses

    3. Filters and coupler

    4. Global Positioning Systems Antennas

    5. Patch Antennas

    6. Power amplifiers and combiners

    7. RF and microwave circuitry

    8. Satellite communication systems


    Our Capabilities (TMM10i)

    PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
    Designation:TMM10i
    Dielectric constant:9.80 ±0.245
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

    Data Sheet of TMM10

    PropertyTMM10iDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess9.80±0.245Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign9.9--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant-43-ppm/°K-55-125IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity2 x 108-Mohm.cm-ASTM D257
    Surface Resistivity4 x 107-Mohm-ASTM D257
    Electrical Strength(dielectric strength)267ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425TGA-ASTM D3850
    Coefficient of Thermal Expansion - x19Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y19Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z20Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.76ZW/m/K80 ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.0 (0.9)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)-X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.8X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.16-%D/24/23ASTM D570
    3.18mm (0.125")0.13
    Specific Gravity2.77--AASTM D792
    Specific Heat Capacity0.72-J/g/KACalculated
    Lead-Free Process CompatibleYES----

    Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold


    Quality Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold for sale
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