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40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

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    Buy cheap 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish from wholesalers
     
    Buy cheap 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish from wholesalers
    • Buy cheap 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish from wholesalers
    • Buy cheap 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish from wholesalers
    • Buy cheap 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish from wholesalers

    40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

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    Brand Name : Bicheng
    Model Number : BIC-164.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish


    Rogers High Frequency PCB Built on Kappa 438 40mil 1.016mm DK 4.38 with Immersion Gold for Distributed Antenna Systems

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.


    Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.


    Features

    1. Glass reinforced hydrocarbon thermoset platform

    2. Tighter Dk and thickness tolerance than FR-4

    3. Low Z Axis CTE of 42 ppm/°C


    Benefits

    1. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

    2. Improved design flexibility and plated through-hole reliability

    3. Automated assembly compatible


    Typical Applications:

    1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

    2. Small Cell and Distributed Antenna Systems (DAS)

    3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)


    Segments: Smart Home and Wireless Meters


    40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish

    40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish


    Our PCB Capability (Kappa 438)

    PCB Material:Glass Reinforced Hydrocarbon Ceramic
    Designation:Kappa 438
    Dielectric constant:4.38
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm)
    PCB thickness:20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish


    Data Sheet of Kappa 438 Laminate

    PropertyTypical Value Kappa 438DirectionUnitsConditionTest Method
    Dielectric Constant, er Design4.38Z-2.5 GHzDifferential Phase Length Method
    Dissipation Factor tan, d0.005Z-10 GHz/23°CIPC-TM-650 2.5.5.5
    Thermal Coefficient of Dielectric Constant e-21-ppm/°C10 GHz (-50 to 150°C)Modified IPC-TM-650 2.5.5.5
    Volume Resistivity2.9 x 109-MΩ•cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity6.2 x 107-MΩCOND AIPC-TM-650 2.5.17.1
    Electrical Strength675ZV/mil-IPC-TM-650 2.5.6.2
    Tensile Strength16 12MD CMDkpsi-ASTM D3039/D3039-14
    Flexural Strength25 19MD CMDkpsi-IPC-TM-650 2.4.4
    Dimensional Stability-0.48 -0.59MD CMDmm/m-IPC-TM-650 2.4.39a
    Coefficient of Thermal Expansion13Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
    16Y
    42Z
    Thermal Conductivity0.64ZW/(m.K)80°CASTM D5470
    Time to Delamination (T288)>60-minutes288°CIPC-TM-650 2.4.24.1
    Tg>280-°C TMA-IPC-TM-650 2.4.24.3
    Td414-°C-IPC-TM-650 2.3.40
    Moisture Absorption0.07-%24/23IPC-TM-650 2.6.2.1
    Young’s Modulus2264 2098MD CMDkpsi-ASTM D3039/D3039-14
    Flex Modulus2337 2123MD CMDkpsi-IPC-TM-650 2.4.4
    Bow0.03-%-IPC-TM-650 2.4.22C
    Twist0.08-%-IPC-TM-650 2.4.22C
    Copper Peel Strength After Thermal Stress5.8-lbs/in1 oz (35 µm) foilIPC-TM-650 2.4.8
    FlammabilityV-0---UL 94
    Specific Gravity1.99-g/cm3-ASTM D792
    Lead-Free Process CompatibleYes---

    Quality 40mil Roger kappa 438 Pcb Circuit Board For Distributed Antenna Systems OSP Surface Finish for sale
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