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Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38

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    Buy cheap Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38 from wholesalers
     
    Buy cheap Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38 from wholesalers
    • Buy cheap Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38 from wholesalers
    • Buy cheap Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38 from wholesalers
    • Buy cheap Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38 from wholesalers

    Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38

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    Brand Name : Bicheng
    Model Number : BIC-163.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38


    Rogers RF PCB Built on Kappa 438 30mil 0.762mm DK 4.38 with Immersion Gold for Small Cells.

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.


    Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.


    Features

    1. Glass reinforced hydrocarbon thermoset platform

    2. Dk of 4.38 is tailored to FR-4 industry standard norms

    3. Tighter Dk and thickness tolerance than FR-4

    4. Low Z Axis CTE of 42 ppm/°C

    5. High Tg of > 280°C TMA

    6. Meets UL 94-V0 requirements


    Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38


    Benefits

    1. Ease of PCB manufacturing and assembly in Line with FR-4

    2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance

    3. Consistent circuit performance

    4. Improved design flexibility and plated through-hole reliability

    5. Automated assembly compatible


    Typical Applications:

    1. Carrier Grade WiFi/Licensed Assisted Access (LAA)

    2. Small Cell and Distributed Antenna Systems (DAS)

    3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)

    4. Internet of Things (IoT)

    Segments: Smart Home and Wireless Meters


    Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38

    Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38


    Our PCB Capability (Kappa 438)

    PCB Material:Glass Reinforced Hydrocarbon Ceramic
    Designation:Kappa 438
    Dielectric constant:4.38
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm)
    PCB thickness:20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    Data Sheet of Kappa 438 Laminate

    PropertyTypical Value Kappa 438DirectionUnitsConditionTest Method
    Dielectric Constant, er Design4.38Z-2.5 GHzDifferential Phase Length Method
    Dissipation Factor tan, d0.005Z-10 GHz/23°CIPC-TM-650 2.5.5.5
    Thermal Coefficient of Dielectric Constant e-21-ppm/°C10 GHz (-50 to 150°C)Modified IPC-TM-650 2.5.5.5
    Volume Resistivity2.9 x 109-MΩ•cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity6.2 x 107-MΩCOND AIPC-TM-650 2.5.17.1
    Electrical Strength675ZV/mil-IPC-TM-650 2.5.6.2
    Tensile Strength16 12MD CMDkpsi-ASTM D3039/D3039-14
    Flexural Strength25 19MD CMDkpsi-IPC-TM-650 2.4.4
    Dimensional Stability-0.48-0.59MD CMDmm/m-IPC-TM-650 2.4.39a
    Coefficient of Thermal Expansion13Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
    16Y
    42Z
    Thermal Conductivity0.64ZW/(m.K)80°CASTM D5470
    Time to Delamination (T288)>60-minutes288°CIPC-TM-650 2.4.24.1
    Tg>280-°C TMA-IPC-TM-650 2.4.24.3
    Td414-°C-IPC-TM-650 2.3.40
    Moisture Absorption0.07-%24/23IPC-TM-650 2.6.2.1
    Young’s Modulus2264 2098MD CMDkpsi-ASTM D3039/D3039-14
    Flex Modulus2337 2123MD CMDkpsi-IPC-TM-650 2.4.4
    Bow0.03-%-IPC-TM-650 2.4.22C
    Twist0.08-%-IPC-TM-650 2.4.22C
    Copper Peel Strength After Thermal Stress5.8-lbs/in1 oz (35 µm) foilIPC-TM-650 2.4.8
    FlammabilityV-0---UL 94
    Specific Gravity1.99-g/cm3-ASTM D792
    Lead-Free Process CompatibleYes---

    Quality Kappa 438 with Immersion Gold Rogers RF Printed Circuit Boards 30mil 0.762mm DK 4.38 for sale
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