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TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

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    Buy cheap TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. from wholesalers
     
    Buy cheap TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. from wholesalers
    • Buy cheap TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. from wholesalers
    • Buy cheap TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. from wholesalers
    • Buy cheap TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. from wholesalers

    TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-156.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.


    TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    General Description

    This is a type of double layer high frequency PCB which is built on 20mil TMM3 substrate. It’s with immersion gold, 1oz copper(finished). Green solder mask is printed on top layer and bottom layer is open to air. This mini PCB is manufactured as per IPC class 3, every 50 boards are packed for shipment. It’s for the application of patch antennas.


    PCB Specifications

    PCB SIZE35 x 51mm=1up
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsNO
    LAYER STACKUPcopper ------- 17um(0.5 oz)+plate TOP layer
    TMM3 0.508mm
    copper ------- 17um(0.5 oz) + plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:5 mil / 5 mil
    Minimum / Maximum Holes:0.40 mm / 2.50 mm
    Number of Different Holes:3
    Number of Drill Holes:3
    Number of Milled Slots:0
    Number of Internal Cutouts:no
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:TMM3 0.508mm
    Final foil external:1.0 oz
    Final foil internal:N/A
    Final height of PCB:0.68 mm ±0.1
    PLATING AND COATING
    Surface FinishImmersion gold, 99%
    Solder Mask Apply To:Top Layer
    Solder Mask Color:Green
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.40mm.
    FLAMIBILITY RATING94V-0
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Typical Applications

    1. Chip testers

    2. Dielectric polarizers and lenses

    3. Filters and coupler

    4. Global Positioning Systems Antennas

    5. Patch Antennas

    6. Power amplifiers and combiners

    7. RF and microwave circuitry

    8. Satellite communication systems


    Our PCB Capability(TMM3)

    PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
    Designation:TMM3
    Dielectric constant:3.27
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

    Data Sheet of TMM3

    PropertyTMM3DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.27±0.032Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign3.45--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant+37-ppm/°K-55-125IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity2 x 109-Mohm.cm-ASTM D257
    Surface Resistivity>9x 10^9-Mohm-ASTM D257
    Electrical Strength(dielectric strength)441ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425TGA-ASTM D3850
    Coefficient of Thermal Expansion - x15Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y15Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z23Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.7ZW/m/K80 ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)16.53X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.72X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.06-%D/24/23ASTM D570
    3.18mm (0.125")0.12
    Specific Gravity1.78--AASTM D792
    Specific Heat Capacity0.87-J/g/KACalculated
    Lead-Free Process CompatibleYES----

    TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

    Quality TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. for sale
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