Introducing our newly shipped 12-layer Printed Circuit Board (PCB), designed for superior performance and reliability in demanding electronic applications. This advanced PCB is engineered with high-quality materials and meticulous attention to detail, making it an ideal solution for a variety of industries, including automotive, telecommunications, and data storage.

Exceptional Specifications
This 12-layer PCB is constructed with precision and care, utilizing high-quality materials that enhance performance and reliability. The board is made from IT-180A and FR-4, with a glass transition temperature (Tg) of 170 °C. The solder mask, applied to both sides, features a striking matte red finish, while the top layer sports a clean white silkscreen print for improved visibility and branding.

The surface finish is ENIG (Electroless Nickel Immersion Gold), ensuring superior solderability and resistance to corrosion. With a total board thickness of 1.6mm (±10%) and dimensions of 80.15mm x 76.6mm, this PCB is designed for high-density applications. It accommodates a minimum hole size of 0.2mm, a solder mask thickness of 10um, and a minimum dielectric thickness of 100um.

Electrical and Mechanical Specifications

Key electrical specifications include:

Minimum Trace Line Width: 120um
Minimum Spacing: 125um
Plated Through Holes: Present across all layers (L1-L12)
Blind Vias: Not applicable

The PCB also features impedance-controlled differential pairs, which are critical for maintaining signal integrity in high-speed applications. Configurations include:

50 Ohm: Top layer (4mil trace/gap)
90 Ohm: Top layer (5mil trace/gap)
100 Ohm: Top layer (6mil trace/gap)

This comprehensive range of specifications makes our PCB suitable for a variety of demanding applications.

Innovative Stack-Up
The stack-up configuration of this PCB is meticulously designed to optimize both electrical performance and thermal management. The configuration includes alternating layers of copper and FR-4, creating a robust structure that minimizes interference while enhancing signal propagation.

Layer Composition
The stack-up consists of the following:

Copper Layers: Strategically placed to provide effective heat dissipation.

FR-4 and IT-180 Core Layers: Ensuring long-term durability and reliability.

This thoughtful layering not only maximizes the electrical characteristics of the PCB but also contributes to its overall integrity, making it suitable for complex and high-density designs.

Commitment to Quality and Compliance
Produced in compliance with IPC-Class-2 standards, this PCB ensures a moderate level of reliability suitable for consumer electronics. The artwork is supplied in the Gerber RS-274-X format, facilitating easy integration with standard manufacturing processes.

Advanced Material: IT-180ATC
A significant advantage of our 12-layer PCB is the use of IT-180ATC, a high-performance epoxy known for its exceptional thermal properties. With a dielectric constant of 4.1 at 10GHz and a dissipation factor of 0.017, this material is ideal for high-frequency applications.

Key Features of IT-180ATC
Thermal Resistance: T260 > 60 minutes, T288 > 20 minutes
Peel Strength: Minimum of 8 lbs/inch
Coefficient of Thermal Expansion (CTE): Matched to copper (X-axis: 11-13 ppm/°C, Y-axis: 13-15 ppm/°C)
Low Z-axis CTE: 45 ppm/°C
Tg: Greater than 175 °C
Low Moisture Absorption: 0.1%
Flammability Rating: UL 94-V0

These properties make IT-180ATC an excellent choice for PCs requiring high thermal reliability and resistance to environmental stressors.

Versatile Applications
Our new 12-layer PCB is versatile and adaptable, making it suitable for a wide range of applications, including:

Automotive Systems: Particularly in engine room electronic control units (ECUs) that require high reliability.

Backplanes: Supporting high-density interconnects for servers and data storage solutions.

Telecommunications: Essential infrastructure for various networking technologies, ensuring robust communication pathways.

Conclusion
This 12-layer PCB represents a significant advancement in PCB technology, engineered to meet the demands of modern electronics. With its exceptional specifications, innovative materials, and versatile applications, this PCB is poised to become a go-to solution for manufacturers and engineers alike.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners