Brief Introduction

This type of ceramic circuit board adopts an complicated 6-layer board design and selects aluminum nitride (AlN) as the substrate. Aluminum nitride features excellent thermal conductivity and electrical insulation properties, enabling efficient heat dissipation. The finished board thickness is 1.5mm, and both the inner and outer layers are 1oz finished copper. This PCB is free of solder mask and silkscreen characters, and the surface finish adopts a 2 micro-inch (2u") immersion gold. They are manufactured per IPC-Class-2 standard.

Basic Specifications

Board dimensions: 51 mm x 52 mm=1PCS, +/- 0.15mm

Minimum Trace/Space: 5/5 mils

Minimum Hole Size: 0.4mm

No Blind vias.

Finished board thickness: 1.5mm +/-10%

Finished Cu weight: 1oz (1.4 mils) outer layers

Via plating thickness: 20 μm

Surface finish: Electroless Nickel Immersion Gold (ENIG)

Top Silkscreen: No

Bottom Silkscreen: No

Top Solder Mask: No

Bottom Solder Mask: No

100% Electrical test used prior to shipment

Introduction of AlN Ceramic Substrates

Aluminum Nitride Ceramic Copper Clad Laminate (AlN copper clad laminate for short) is a special electronic material with aluminum nitride (AlN) ceramic as the substrate and a high-purity copper layer on the surface. It combines the ultra-high thermal conductivity of aluminum nitride ceramic, excellent electrical insulation, and the superior electrical conductivity of metallic copper, becoming one of the core materials in the fields of high-power electronic devices, high-frequency communication, new energy vehicles, etc., and is known as the "ultimate solution to the heat dissipation problem in the electronics industry".

Features & Benefits

1. Ultra-high Thermal Conductivity Performance

The thermal conductivity of aluminum nitride is as high as 170-200 W/(m·K), which is 8-10 times that of traditional aluminum oxide ceramic (Al₂O₃). It can quickly conduct the heat generated by electronic components to the heat dissipation system, significantly reducing the chip junction temperature and improving the reliability and lifespan of the equipment.

2. Low Coefficient of Thermal Expansion, Matching Semiconductor Materials

The coefficient of thermal expansion of aluminum nitride (4.5×10⁻⁶/℃) is close to that of semiconductor materials such as silicon (Si) and silicon carbide (SiC), which can greatly reduce the risk of stress cracking during thermal cycling and is suitable for high-temperature and high-power scenarios.

3. Excellent Electrical Insulation and High-frequency Performance

Aluminum nitride has a low dielectric constant (8.8-9.5) and low dielectric loss (<0.001), which can effectively reduce signal delay and energy loss during high-frequency signal transmission, making it an ideal choice for high-frequency devices such as 5G base stations and millimeter-wave radars.

4. High Mechanical Strength and Corrosion Resistance

Aluminum nitride ceramic has high hardness and strong chemical stability. The copper cladding processes (such as Direct Bonding of Copper, DBC or Active Metal Brazing, AMB) ensure a tight bond between the copper layer and the substrate. It is resistant to high temperature and corrosion and can be used for a long time in harsh environments.

Data Sheets

Material Thickness

Typical Applications

Electric Vehicle Inverters:

Using a 1mm aluminum nitride substrate as the heat dissipation carrier for the IGBT reduces the operating temperature of the module by 20-30℃, improving energy efficiency and lifespan.

GaN Power Amplifier Modules in 5G Base Stations:

The aluminum nitride substrate solves the problem of high-frequency heat generation and ensures signal stability.

Industrial Laser Cutting Machines:

It is used for heat dissipation of the CO₂ laser circuit, avoiding the beam drift caused by high temperatures.

Future Trends

With the popularization of third-generation semiconductors (SiC, GaN), the demand for heat dissipation in high-power density devices has surged. Aluminum nitride ceramic circuit boards will continue to expand in the following fields:

• New Energy: Photovoltaic inverters, energy storage systems.

• Artificial Intelligence: Heat dissipation carrier boards for AI chips.

• 6G Communication: Substrate materials for terahertz frequency band circuits.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners