Introduction
In today’s advanced RF and high-frequency electronics, signal integrity, thermal stability, and reliability are non-negotiable. Our 18-layer rigid PCB, constructed with Rogers RO4350B laminates and RO4450F bondply, is designed to meet the most demanding requirements in telecommunications, automotive radar, and aerospace applications. With ultra-low loss, tight dielectric constant (Dk) control, and superior thermal performance, this PCB ensures optimal functionality even in extreme conditions.

Precision Construction & Key Specifications
Every detail of this PCB is engineered for high-frequency stability and durability:

Base Material: High-performance RO4350B (core) + RO4450F (bondply) for superior RF characteristics.

Layer Count: 18 layers with 4/4 mil trace/space and 0.4mm minimum hole size.

Blind Vias: Mechanically drilled (L11-L18) for high-density interconnects.

Surface Finish: Immersion Gold + Selective Hard Gold (50 μin) for excellent solderability and corrosion resistance.

Via-in-Pad & Press-Fit Holes: Supported for enhanced mechanical and electrical performance.

Resin-Filled & Capped Vias: Improve reliability and prevent solder wicking.

100% Electrical Tested: Guaranteed functionality before shipment.

Optimized Stackup for Maximum Performance
The 18-layer stackup is meticulously designed to minimize signal loss and ensure thermal stability:

Alternating RO4350B cores (4mil) and RO4450F bondply (4mil) for consistent impedance control.

35μm copper layers (1oz) on all inner and outer layers for optimal current handling.

Low Z-axis CTE (32 ppm/°C) prevents via cracking under thermal stress.

High Tg (>280°C) ensures stability in high-temperature environments.

Why Rogers RO4350B & RO4450F?
RO4350B Laminates – The Gold Standard for RF PCBs

Dielectric Constant (Dk): 3.48 ±0.05 @ 10GHz – Ensures consistent signal propagation.

Ultra-Low Loss: Dissipation Factor (Df) of 0.0037 minimizes signal degradation.

Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation.

CTE Matched to Copper: Reduces warping and ensures dimensional stability.

RO4450F Bondply – Superior Multi-Layer Performance

Compatible with Sequential Lamination: Ideal for complex, high-layer-count designs.

Enhanced Lateral Flow: Ensures reliable filling of tight spaces.

High Thermal Resilience: Withstands multiple lamination cycles.

Ideal Applications
This PCB is perfect for industries requiring high-frequency precision and reliability, including:

5G & Cellular Base Stations (Antennas, Power Amplifiers)

Automotive Radar & ADAS Sensors

Satellite & Aerospace Communication Systems

RFID & IoT Devices

Quality Assurance & Global Availability
We adhere to IPC-Class-2 standards, ensuring high reliability for commercial and industrial applications. Our manufacturing process supports Gerber RS-274-X files, and we offer worldwide shipping to meet your production timelines.

Upgrade your high-frequency designs with a PCB that delivers performance, durability, and precision. Contact us now for competitive pricing, fast lead times, and Professional customer service.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners