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Brand Name : | Bicheng |
Certification : | UL, ISO9001, IATF16949 |
Price : | USD9.99-99.99/PCS |
Payment Terms : | T/T |
Supply Ability : | 5000PCS per month |
Delivery Time : | 8-9 working days |
We are proud to present our cutting-edge 8-layer printed circuit board (PCB), meticulously engineered using high-quality RO4350B materials. This PCB is specifically designed to meet the demands of high-performance electronic applications, delivering exceptional reliability and efficiency across a wide range of environments.
Key Specifications
- Base Material: Our PCB utilizes premium RO4350B, renowned for its
electrical performance and manufacturability.
- Layer Count: The board consists of 8 layers, allowing for complex
designs and enhanced functionality.
- Board Dimensions: Measuring 96.4 mm x 163.9 mm (with a tolerance
of ±0.15 mm), this board is compact yet spacious enough to
accommodate various components.
- Minimum Trace/Space: The design includes fine traces and spaces
of 4/6 mils, ensuring high-density layouts.
- Minimum Hole Size: Features a minimum hole size of 0.4 mm,
suitable for a wide range of components.
- Finished Board Thickness: The completed board boasts a thickness
of 1.8 mm, providing strength and durability.
- Finished Copper Weight: The outer layers have a copper weight of
1 oz (1.4 mils), while the inner layers feature a combination of 1
oz (1.4 mils) and 0.5 oz (0.7 mils).
- Surface Finish: Our boards come with an Electroless Nickel
Immersion Gold finish, enhancing solderability and protecting
against oxidation.
- Silkscreen: The top and bottom layers are marked with white
silkscreen for clear identification of components.
- Solder Mask: Both sides of the board are coated with a green
solder mask for added protection and aesthetic appeal.
- Vias: All vias are resin filled and capped, ensuring reliable
connections and improved thermal performance.
- Electrical Testing: Each board undergoes a rigorous 100%
electrical test prior to shipment, guaranteeing functionality and
performance.
- Impedance Control: Impedance is meticulously controlled at 50 ohms on specified layers, enhancing signal integrity.
Construction Details
This advanced PCB features a sophisticated stackup that combines
multiple layers of Rogers RO4350B and RO4450F bondply materials.
This unique construction not only provides excellent thermal
stability but also ensures superior electrical performance, making
it ideal for high-frequency applications. The tight control over
dielectric properties allows for reliable operation in demanding
environments.
RO4350B Typical Value | |||||
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Performance Features
- Dielectric Constant (RO4350B): The dielectric constant is
maintained at 3.48 ± 0.05 at 10 GHz, minimizing signal loss.
- Thermal Conductivity: With a thermal conductivity of 0.69 W/m/°K,
this PCB effectively dissipates heat, enhancing overall
performance.
- High Tg (>280 °C): The high glass transition temperature
ensures stability during processing and operational reliability.
- Low Water Absorption: The material exhibits a low water absorption rate of 0.06%, further enhancing its durability in various conditions.
Applications
This 8-layer PCB is versatile and well-suited for an array of
applications, including but not limited to:
- Cellular Base Station Antennas: Ideal for enhancing communication
signals.
- RF Identification Tags: Perfect for applications requiring
precise tracking.
- Automotive Radar and Sensors: Designed to meet the stringent
requirements of automotive technologies.
- LNBs for Direct Broadcast Satellites: Ensuring high performance in satellite communications.
Quality Assurance
Manufactured in accordance with IPC-Class-2 standards, this PCB
adheres to strict quality control measures, ensuring that each unit
is durable and capable of performing under critical conditions.
Availability
This advanced PCB is available for purchase worldwide, providing
you with the opportunity to integrate state-of-the-art technology
into your electronic projects.
Conclusion
Elevate your electronic designs with our superior 8-layer RO4350B
PCB. Its exceptional materials, meticulous construction, and
rigorous quality assurance make it the perfect choice for
high-performance applications in today’s fast-evolving
technological landscape. Experience enhanced reliability and
efficiency with our advanced PCB solutions.
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