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2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish

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    Buy cheap 2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish from wholesalers
     
    Buy cheap 2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish from wholesalers
    • Buy cheap 2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish from wholesalers

    2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish

    Introducing our newly shipped TC600 Double-Sided PCB, engineered to meet the high-performance demands of modern electronic applications. Utilizing advanced TC600 laminates, this PCB offers exceptional thermal management and reliability, making it ideal for a variety of high-frequency and high-power applications.


    Premium Base Material: TC600
    This TC600 PCB is constructed using Rogers TC600 laminates, which consist of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. This advanced composite material is designed to enhance heat transfer and minimize dielectric loss, resulting in improved performance in high-frequency applications.


    Layer Count and Dimensions
    This PCB features a double-sided construction, which maximizes functionality while optimizing space. With dimensions of 76mm x 57mm (±0.15mm) and a finished thickness of 1.6mm, this PCB is versatile enough for various electronic devices.


    Trace and Hole Specifications
    The board is engineered with a minimum trace and space of 4/5 mils, ensuring precise circuit layouts. A minimum hole size of 0.3mm is maintained, with no blind vias, ensuring structural integrity and reliability.


    Copper Layers and Surface Finish
    This PCB features two copper layers, each comprising 18 μm of copper and an additional 17 μm of plating. The immersion gold surface finish enhances solderability and provides excellent protection against oxidation.


    Quality Assurance
    Each board undergoes rigorous 100% electrical testing prior to shipment, ensuring compliance with IPC-Class-2 quality standards and guaranteeing reliability for various applications.


    PropertyUnitValueTest Method
    1. Electrical Properties
    Dielectric Constant (may vary by thickness)
    @1.8 MHz-6.15Resonant Cavity
    @10 GHz-6.15IPC TM-650 2.5.5.5
    Dissipation Factor
    @1.8 GHz-0.0017Resonant Cavity
    @10 GHz-0.002IPC TM-650 2.5.5.5
    Temperature Coefficient of Dielectric-
    TCεr @ 10 GHz (-40-150°C)ppm/ºC-75IPC TM-650 2.5.5.5
    Volume Resistivity
    C96/35/90MΩ-cm1.6x109IPC TM-650 2.5.17.1
    E24/125MΩ-cm2.4x108IPC TM-650 2.5.17.1
    Surface Resistivity
    C96/35/903.1x109IPC TM-650 2.5.17.1
    E24/1259.0x108IPC TM-650 2.5.17.1
    Electrical StrengthVolts/mil (kV/mm)850 (34)IPC TM-650 2.5.6.2
    Dielectric BreakdownkV62IPC TM-650 2.5.6
    Arc Resistancesec>240IPC TM-650 2.5.1
    2. Thermal Properties
    Decomposition Temperature (Td)
    Initial°C512IPC TM-650 2.4.24.6
    5%°C572IPC TM-650 2.4.24.6
    T260min>60IPC TM-650 2.4.24.1
    T288min>60IPC TM-650 2.4.24.1
    T300min>60IPC TM-650 2.4.24.1
    Thermal Expansion, CTE (x,y) 50-150ºCppm/ºC9, 9IPC TM-650 2.4.41
    Thermal Expansion, CTE (z) 50-150ºCppm/ºC35IPC TM-650 2.4.24
    % z-axis Expansion (50-260ºC)%1.5IPC TM-650 2.4.24
    3. Mechanical Properties
    Peel Strength to Copper (1 oz/35 micron)
    After Thermal Stresslb/in (N/mm)10 (1.8)IPC TM-650 2.4.8
    At Elevated Temperatures (150ºC)lb/in (N/mm)10 (1.8)IPC TM-650 2.4.8.2
    After Process Solutionslb/in (N/mm)9 (1.6)IPC TM-650 2.4.8
    Young’s Moduluskpsi (MPa)280 (1930)IPC TM-650 2.4.18.3
    Flexural Strength (Machine/Cross)kpsi (MPa)9.60/9.30 (66/64)IPC TM-650 2.4.4
    Tensile Strength (Machine/Cross)kpsi (MPa)5.0/4.30 (34/30)IPC TM-650 2.4.18.3
    Compressive Moduluskpsi (MPa)ASTM D-3410
    Poisson’s Ratio-ASTM D-3039
    4. Physical Properties
    Water Absorption%0.02IPC TM-650 2.6.2.1
    Density, ambient 23ºCg/cm32.9ASTM D792 Method A
    Thermal Conductivity (z-axis)W/mK1.1ASTM E1461
    Thermal Conductivity (x, y)W/mK1.4ASTM E1461
    Specific HeatJ/gK0.94ASTM E1461
    FlammabilityclassV0UL-94
    NASA Outgassing, 125ºC, ≤10-6 torr
    Total Mass Loss%0.02NASA SP-R-0022A
    Collected Volatiles%0NASA SP-R-0022A
    Water Vapor Recovered%0NASA SP-R-0022A

    Technical Features


    Dielectric Properties
    The TC600 laminate exhibits a dielectric constant (Dk) of 6.15 at both 1.8MHz and 10GHz. This property is essential for reducing signal loss and enhancing overall circuit performance, particularly in RF applications.


    Thermal Management
    With a thermal conductivity of 1.1 W/mK, the TC600 PCB excels in heat dissipation, making it ideal for high-power applications. The low dissipation factor—0.0017 at 1.8GHz and 0.0020 at 10GHz—further contributes to efficient thermal management.


    Stability Across Temperatures
    The TC600 PCB maintains a stable Dk across a wide temperature range of -40°C to 140°C, with a low coefficient of thermal expansion (CTE) of 9 ppm/°C in the X/Y axes and 35 ppm/°C in the Z axis. This stability is crucial for minimizing stress on solder joints, enhancing the longevity and reliability of the PCB.


    Benefits of the TC600 PCB

    1. Size Reduction: TC600 PCB enables a smaller footprint compared to lower Dk substrates, allowing for more compact designs.

    2. Enhanced Efficiency: By reducing heat generation through minimized transmission line losses, the PCB improves overall efficiency, crucial for high-performance applications.


    3. Increased Reliability: Improved processing capabilities and CTE matching ensure low-stress solder joints, making the PCB highly reliable in demanding environments.


    2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish


    Applications

    TC600 PCB is versatile and suitable for a range of applications, including:


    - Power Amplifiers: Essential for maximizing signal strength in communication devices.

    - Filters and Couplers: Used in RF applications to manage frequency signals effectively.

    - Microwave Combiners and Power Dividers: Critical for efficient signal processing in advanced communication systems, particularly in avionics.

    - Small Footprint Antennas: Ideal for applications requiring compact designs, such as GPS and hand-held RFID reader antennas.

    - Digital Audio Broadcasting (DAB) Antennas: Perfect for satellite radio applications, ensuring high-quality audio transmission.


    Conclusion

    TC600 Double-Sided PCB represents a significant advancement in PCB technology, designed to meet the rigorous demands of modern electronics. With its exceptional materials, meticulous construction, and robust testing, this PCB is poised to elevate the standards of performance in various high-frequency applications.


    Engineers and manufacturers can trust the TC600 PCB to deliver reliability, efficiency, and innovation, paving the way for the next generation of electronic devices.

    Quality 2 Layer PCB Built On TC600 Laminate 60mil Immersion Gold Finish for sale
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