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M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

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    Buy cheap M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish from wholesalers
     
    Buy cheap M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish from wholesalers
    • Buy cheap M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish from wholesalers

    M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

    This 6-layer PCB crafted from high-performance Megtron6 (M6) R-5775G. Engineered for high-speed, low-loss applications, it is ideal for cutting-edge technologies such as 5G communication, automotive electronics, and high-performance computing.


    Construction Details

    This 6-layer PCB is meticulously engineered to meet the rigorous demands of today’s electronic devices. Here are the key construction details:


    - Base Material: Megtron6 (M6) - R5775G (HVLP)
    - Layer Count: 6 layers, allowing for complex circuit designs.
    - Board Dimensions: 81.9 mm x 53.7 mm, with a tolerance of ±0.15 mm, ensuring precise fit in device enclosures.
    - Minimum Trace/Space: 4/5 mils, facilitating high-density layouts.
    - Minimum Hole Size: 0.3 mm, accommodating various component types.
    - Finished Board Thickness: 1.4 mm, optimized for durability.
    - Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), providing excellent solderability and corrosion resistance.


    PropertyUnitsTest MethodConditionTypical Value
    THERMALGlass Transition Temp ( Tg )CDSCAs received185
    DMAAs received210
    Thermal Decomposition TempCTGAAs received410
    Time to Delam (T288)Without CuMinIPC TM-650 2.4.24.1As received> 120
    With CuMinIPC TM-650 2.4.24.1As received> 120
    CTE : α1X - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg14 - 16
    Y - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg14 - 16
    Z - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg45
    CTE : α2Z - axis ppm / Cppm / CIPC TM-650 2.4.24> Tg 260260
    ELECTRICALVolume ResistivityMΩ - cmIPC TM-650 2.5.17.1C-96/35/901 x 109
    Surface ResistivityMΩIPC TM-650 2.5.17.1C-96/35/901 x 108
    Dielectric Constant ( Dk )@ 1GHz/IPC TM-650 2.5.5.9C-24/23/503.71
    @ 10GHz/IPC TM-650 2.5.5.5C-24/23/503.61
    Dissipation Factor ( Df )@ 1GHz/IPC TM-650 2.5.5.9C-24/23/500.002
    @ 10GHz/IPC TM-650 2.5.5.5C-24/23/500.004
    PHYSICALWater Absorption%IPC TM-650 2.6.2.1D-24/230.14
    Peel Strength1oz ( H-VLP )kN / mIPC TM-650 2.4.8As Received 0.80.8
    Flammability/ULC-48/23/5094V-0

    Stackup Configuration

    The stackup of our PCB is designed for optimal performance in high-frequency applications:


    Copper Layers: Multiple layers of copper ranging from 17 μm to 35 μm, strategically placed for effective signal transmission.


    Prepreg Materials: R-5670(G) prepregs provide stability and insulation between copper layers.


    Core Material: M6 Core R5775G (HVLP) ensures low dielectric loss and high thermal reliability.


    M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish


    Advantages of Megtron6 (M6) R-5775G


    High-Speed Performance
    Megtron6 laminate is specifically formulated for high-frequency applications. With a dielectric constant of 3.4 at 1 GHz and 3.34 at 13 GHz, it minimizes signal loss, making it ideal for 5G communications and other high-speed technologies.


    Low Dielectric Loss
    The dissipation factor of 0.002 at 1 GHz and 0.0037 at 13 GHz ensures that energy is efficiently transmitted, reducing heat generation and improving overall performance.


    Thermal Reliability
    The high Tg value (>185 °C) and thermal decomposition temperature (Td) of 410 °C make this PCB suitable for environments with significant thermal challenges, such as automotive and aerospace applications.


    Environmental Compliance
    This PCB is RoHS compliant and halogen-free, aligning with global standards for green manufacturing. This commitment to sustainability is crucial for modern electronic design.


    PCB Material:Low DK Glass Cloth
    Designation:Laminate R-5775(G), Prepreg R-5670(G)
    Dielectric constant:3.61 10GHz
    Dissipation Factor0.004 10GHz
    Layer count:Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

    Typical Applications

    5G Communication: Base stations, millimeter-wave antennas, RF front-ends


    Automotive Electronics: 77 GHz radar systems, ADAS


    Data Centers: High-speed server motherboards, optical module PCBs


    Aerospace: Circuit boards for satellite communication and radar


    Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices


    Conclusion
    This PCB with Megtron6 material is a pivotal component in the landscape of modern electronics. From high-speed communication to automotive safety systems, its advanced features and materials provide the foundation for innovative designs. As technology continues to advance, this PCB stands ready to meet the challenges of tomorrow’s high-performance applications. Embrace the future of electronics with our sophisticated, reliable, and environmentally responsible PCB solutions.


    M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish

    Quality M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish for sale
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