This high-performance PCB is engineered to meet the stringent requirements of a variety of high-frequency applications, ensuring reliability and precision.

Understanding RF-60A Material

The RF-60A is part of Taconic's esteemed ORCER family, known for its exceptional organic-ceramic laminate construction. This material is crafted with woven glass reinforcement, which enhances dimensional stability and flexural strength, making it ideal for demanding electronic applications. The innovative formulation of RF-60A results in low moisture absorption and uniform electrical properties, setting a benchmark for reliability in challenging environments.

Key Properties of RF-60A

The robust characteristics of RF-60A make it a preferred material for high-frequency applications:

- Dielectric Constant (Dk): 6.15 at 10 GHz. This low Dk allows for minimal signal loss and improved performance in RF applications.
- Dissipation Factor: 0.0038 at 10 GHz/23°C. This low dissipation factor ensures efficient signal transmission with reduced heat generation.
- Moisture Absorption: 0.02%. The low moisture absorption rate contributes to enhanced reliability in humid environments.
- Thermal Conductivity: 0.4 W/MK. This property aids in effective heat dissipation, crucial for high-power applications.

- CTE (Coefficient of Thermal Expansion):
- X-axis: 9 ppm/°C
- Y-axis: 8 ppm/°C
- Z-axis: 69 ppm/°C

- Outgassing Properties: 0.02% TML, 0.01% WVR. These characteristics make RF-60A suitable for space-constrained applications.

These properties ensure that the RF-60A PCB maintains performance integrity even under extreme conditions, which is essential for applications in aerospace, telecommunications, and medical devices.

Detailed PCB Specifications

This PCB features a sophisticated 2-layer rigid construction that optimizes performance for high-frequency applications. Below are the precise specifications that define its capabilities:

Technical Specifications

- Base Material: RF-60A
- Layer Count: 2 layers, providing a balance of complexity and efficiency.
- Board Dimensions: 65mm x 14mm (±0.15mm), allowing for compact designs without sacrificing functionality.
- Minimum Trace/Space: 4/6 mils, facilitating intricate circuit designs.
- Minimum Hole Size: 0.3mm, accommodating various electronic components.
- Finished Board Thickness: 0.7mm, ensuring durability and reliability.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, providing robust electrical connections.
- Via Plating Thickness: 20 μm, enhancing the durability of connections between layers.
- Surface Finish: Immersion Gold, ensuring excellent solderability and corrosion resistance.
- Top Silkscreen: Black, providing clear identification for components.
- Top Solder Mask: Blue, contributing to aesthetic and functional design.
- Electrical Testing: 100% tested prior to shipment, ensuring quality assurance.
- Global Availability: Yes, making it accessible for manufacturers worldwide.

PCB Stackup Structure

The stackup of the RF-60A PCB consists of:

- Copper Layer 1: 35 μm, ensuring effective signal transmission.
- RF-60A Dielectric: 0.635 mm (25 mils), providing essential insulation and stability.
- Copper Layer 2: 35 μm, allowing for complex circuit configurations.

This carefully designed configuration ensures optimal performance and reliability, particularly in high-frequency applications.

Applications in Industry

The RF-60A PCB is well-suited for various high-frequency applications, including:

Power Amplifiers: Used in communication systems where signal strength is critical.

Filters and Couplers: Essential for signal processing and routing in RF circuits.

Miniaturized Antennas: Ideal for compact designs in modern communication devices.

Passive Components: Such as capacitors and resistors, where stability and reliability are paramount.

Compliance and Sustainability

The RF-60A PCB adheres to IPC-Class-2 standards, ensuring that it meets high-quality manufacturing benchmarks. Additionally, it is RoHS and WEEE compliant, reflecting a commitment to environmental sustainability and responsible manufacturing practices. This compliance not only ensures safety for end-users but also aligns with global efforts to minimize electronic waste.

Conclusion
With its advanced RF-60A material, high precision, and robust design, the 2-layer rigid PCB is positioned as the perfect solution for your next electronic project. Superior quality and reliability are offered, tailored for high-frequency applications!

For further inquiries or to place an order, please reach out to our dedicated sales team.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners