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RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ

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    Buy cheap RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ from wholesalers
     
    Buy cheap RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ from wholesalers
    • Buy cheap RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ from wholesalers
    • Buy cheap RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ from wholesalers
    • Buy cheap RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ from wholesalers

    RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ

    Introducing our newly shipped PCB featuring the cutting-edge Rogers RO3006 laminates. Designed with exceptional electrical and mechanical stability, this ceramic-filled PTFE composite ensures reliable performance in a wide range of applications. With a stable dielectric constant (Dk) over varying temperatures, it eliminates the step change in Dk commonly experienced with PTFE glass materials near room temperature.


    Key Features:

    Rogers RO3006 ceramic-filled PTFE composites
    Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C
    Dissipation factor of 0.002 at 10 GHz/23°C
    Td> 500°C
    Thermal Conductivity of 0.79 W/mK
    Moisture Absorption of 0.02%
    Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C


    RO3006 Typical Value
    PropertyRO3006DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess6.15±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign6.5Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.002Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-262Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.27
    0.15
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity105COND AIPC 2.5.17.1
    Tensile Modulus1498
    1293
    X
    Y
    MPa23℃ASTM D 638
    Moisture Absorption0.02%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.86j/g/kCalculated
    Thermal Conductivity0.79W/M/K50℃ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    17
    17
    24
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500℃ TGAASTM D 3850
    Density2.6gm/cm323℃ASTM D 792
    Copper Peel Stength7.1Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    Benefits:

    Uniform mechanical properties for a range of dielectric constants:
    Ideal for multi-layer board designs with varying dielectric constants
    Suitable for use with epoxy glass multi-layer board hybrid designs
    Low in-plane expansion coefficient (matching copper):
    Allows for more reliable surface mounted assemblies
    Ideal for temperature-sensitive applications
    Excellent dimensional stability
    Volume manufacturing process:
    Economical laminate pricing

    PCB Stackup:

    2-layer rigid PCB
    Copper_layer_1: 35 μm
    Rogers RO3006 Substrate: 50mil (1.27mm)
    Copper_layer_2: 35 μm


    PCB Material:Ceramic-filled PTFE Composites
    Designation:RO3006
    Dielectric constant:6.15
    Dissipation Factor0.002 10GHz
    Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    Laminate thickness:5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


    PCB Construction Details:

    This PCB has a compact size with dimensions of 55mm x 47mm, making it suitable for space-constrained applications. It features a minimum trace/space width of 4/6 mils, allowing for precise routing of signals and efficient use of board space. The minimum hole size is 0.3mm, enabling the installation of small components and facilitating ease of assembly.


    The board does not include blind vias, simplifying the manufacturing process and reducing costs. With a finished board thickness of 1.4mm, it strikes a balance between durability and space efficiency. The outer layers have a copper weight of 1 oz (1.4 mils), providing sufficient conductivity for signal transmission and power distribution. The via plating thickness is 20 μm, ensuring reliable connections between different layers of the PCB.


    The surface finish of this PCB is immersion gold, which offers excellent corrosion resistance and solderability, ensuring robust performance in various environments. The top silkscreen is presented in white, providing clear and readable component labeling for ease of assembly and identification. The board does not include a bottom silkscreen or top/bottom solder masks, simplifying the manufacturing process and reducing costs.


    Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.


    RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ


    PCB Statistics:

    This PCB comprises 16 components, allowing for the creation of complex electronic circuits. It features a total of 46 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 29 are dedicated to thru-hole components, while 17 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB.


    The board includes 41 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there are 3 nets, representing the distinct electrical paths within the PCB design.


    The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.


    This PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.


    The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.


    Some Typical Applications:

    Automotive radar applications
    Global positioning satellite antennas
    Cellular telecommunications systems: power amplifiers and antennas
    Patch antenna for wireless communications
    Direct broadcast satellites
    Datalink on cable systems
    Remote meter readers
    Power backplanes


    Experience the reliability and performance of our worldwide available PCB featuring Rogers RO3006 laminates. Designed for a range of applications, from automotive radar to power backplanes, this PCB ensures exceptional electrical and mechanical stability in demanding environments. Trust in its uniform mechanical properties, low in-plane expansion coefficient, and cost-effective manufacturing process for your next project.

    Quality RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ for sale
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