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1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold

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    Buy cheap 1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold from wholesalers
     
    Buy cheap 1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold from wholesalers
    • Buy cheap 1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold from wholesalers
    • Buy cheap 1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold from wholesalers
    • Buy cheap 1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold from wholesalers

    1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold

    Introducing the Advanced High-Frequency PCB for Power and Antenna Applications-RF-60TC PCB. RF-60TC is a cutting-edge high-frequency material designed to meet the demands of high-power RF and microwave applications. This thermally conductive, ceramic-filled, glass-reinforced PTFE laminate offers exceptional performance for applications requiring lower operating temperatures, improved gains, and efficiencies in miniaturized antenna designs. RF-60TC sets a new standard in the 6.15 DK market by providing excellent dielectric heat dissipation and remarkably low dielectric losses.


    Key Features of RF-60TC:

    1. Glass Reinforced PTFE Ceramic Composites:
    RF-60TC incorporates advanced glass-reinforced PTFE ceramic composites, ensuring superior performance and reliability in high-power applications.


    2. Precise Dielectric Constant (Dk) of 6.15 at 10 GHz:
    With a stable Dk of 6.15 at 10 GHz, RF-60TC guarantees consistent electrical performance across a wide range of frequencies, enabling accurate signal propagation.


    3. Low Dissipation Factor:
    RF-60TC boasts a low dissipation factor of 0.002 at 10 GHz and 23°C, allowing for efficient power transfer while minimizing energy loss.


    4. Thermal Coefficient of Dk:
    The material exhibits a thermal coefficient of Dk of -3.58 ppm/°C during a temperature range of -50°C to 150°C, ensuring stable electrical characteristics even under varying thermal conditions.


    5. Excellent Thermal Conductivity:
    RF-60TC offers high thermal conductivity values, providing enhanced heat transfer and allowing for additional design margin. It helps extend the lifetime of active components and improves long-term reliability. The thermal conductivity values are 0.9 W/M*K (unclad), 1.0 W/M*K (0.5oz copper), and 1.05 W/M*K (1oz copper).


    6. Low Moisture Absorption:
    With a moisture absorption rate of only 0.03%, RF-60TC maintains its electrical and mechanical properties, ensuring consistent performance over time.


    7. Dimensional Stability and CTE:

    RF-60TC features low coefficients of thermal expansion (CTE) with X-axis and Y-axis values of 9.9 ppm/°C and a Z-axis value of 40 ppm/°C. This excellent dimensional stability enables the construction of high layer count multilayer PCBs with improved plated through hole reliability.


    RF-60TC Typical Values
    PropertyTest MethodUnitValueUnitValue
    Dk @ 10 GHzIPC-650 2.5.5.5.1 (Modified)6.15 ± 0.156.15 ± 0.15
    Df @ 10 GHzIPC-650 2.5.5.5.1 (Modified)0.0020.002
    TcKppm/°C-3.581ppm/°C-3.581
    Dielectric BreakdownIPC-650 2.5.6kV55kV55
    Dielectric StrengthIPC-650 2.5.6.2V/mil550V/mm21,654
    Arc ResistanceIPC-650 2.5.1Seconds>180Seconds>180
    Moisture AbsorptionIPC-650 2.6.2.1%0.03%0.03
    Flexural Strength (MD)IPC-650 2.4.4psi10,000N/mm269
    Flexural Strength (CD)IPC-650 2.4.4psi9,000N/mm262
    Tensile Strength (MD)IPC-650 2.4.19psi9,000N/mm262
    Tensile Strength (CD)IPC-650 2.4.19psi7,000N/mm248
    Young’s Modulus (MD)ASTM D 3039/IPC-TM-650 2.4.19kpsi721N/mm24971
    Poisson’s Ratio (MD)ASTM D 3039/IPC-TM-650 2.4.190.1550.155
    Peel Strength (1 oz. ED)IPC-650 2.4.8lbs/in8N/mm1.43
    Thermal Conductivity (Unclad)IPC-650 2.4.50W/M*K0.9W/M*K0.9
    Thermal Conductivity (CH/CH)IPC-650 2.4.50W/M*K1W/M*K1
    Thermal Conductivity (C1/C1)IPC-650 2.4.50W/M*K1.05W/M*K1.05
    Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.01mm/M0.01
    Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.69mm/M0.69
    Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.06mm/M0.06
    Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.8mm/M0.8
    Surface ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm1.0 x 108Mohm1.0 x 108
    Volume ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm/cm1.0 x 108Mohm/cm1.0 x 108
    CTE (X, Y axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C9.9ppm/°C9.9
    CTE (Z axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C40ppm/°C40
    Density (Specific Gravity)IPC-650 2.3.5g/cm32.84g/cm32.84
    Specific HeatIPC-650 2.4.50J/gK0.94J/gK0.94
    Td (2% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F930°C500
    Td (5% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F960°C515
    Flammability RatingUL 94V-0V-0

    Benefits of RF-60TC:

    - Improved loss tangent for better signal integrity.
    - High thermal conductivity for efficient heat dissipation.
    - Enhanced dimensional stability for reliable performance.
    - Low Z-axis CTE of 40 ppm/°C for reduced stress on components.
    - Excellent adhesion to metal for secure connections.
    - Stable Dk over frequency and temperature for consistent performance.
    - Low moisture absorption for long-term reliability.


    PCB Construction Details:
    This 2-layer rigid PCB constructed with a copper layer thickness of 35 μm on both sides. The RF-60TC substrate has a thickness of 0.127 mm (5 mils), providing the desired electrical properties. The board dimensions are 54.19mm x 34.47mm (1PCS) with a tolerance of +/- 0.15mm, ensuring precise dimensions for your specific requirements. The PCB undergoes 100% electrical testing prior to shipment, ensuring its reliability and adherence to quality standards.


    PCB Material:PTFE based, ceramic filled fiberglass
    Designation:RF-60TC
    Dielectric constant:6.15
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm)
    PCB thickness:10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

    1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold


    PCB Statistics:

    This RF PCB features 14 components and a total of 32 pads, including 21 thru-hole pads and 11 top SMT pads. It includes 21 vias and has 3 nets, offering flexibility in circuit connections.


    Artwork and Quality Standards:

    RF-60TC PCBs are compatible with Gerber RS-274-X artwork files and are manufactured to meet the IPC-Class-2 quality standard, guaranteeing reliability and consistent performance. They are available for worldwide purchase, allowing engineers and manufacturers from all regions to benefit from their exceptional quality.


    Typical Applications of RF-60TC:

    Experience the exceptional performance and reliability of RF-60TC in your high-power amplifiers, miniaturized antennas, GPS devices, filters, couplers, dividers, and satellites. Order RF-60TC PCBs today and take your designs to new heights of efficiency and performance.

    Quality 1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold for sale
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