Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.

Key Features:

The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".

Benefits:

The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.

This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:

1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.

2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.

3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.

By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.

PCB Specifications:

- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.

PCB Statistics:

- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3

Artwork and Quality:

This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.

Typical Applications:

The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners