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RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

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    Buy cheap RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin from wholesalers
     
    Buy cheap RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin from wholesalers
    • Buy cheap RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin from wholesalers
    • Buy cheap RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin from wholesalers
    • Buy cheap RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin from wholesalers
    • Buy cheap RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin from wholesalers

    RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

    Introducing a High-Performance PCB on CLTE-XT. Rogers CLTE-XT laminates are composite materials that combine micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement. Intended to deliver exceptional performance, CLTE-XT offers the lowest insertion loss and highest dimensional stability in its class. Let's explore the remarkable features and benefits of this cutting-edge PCB:


    Features:

    Dielectric Constant (DK) range of 2.79 to 2.94 at 10GHz, 23°C @ 50% RH
    Dissipation Factor of 0.0010 at 10GHz, 23°C @ 50% RH
    X-axis CTE of 12.7ppm/°C, Y-axis CTE of 13.7ppm/°C, Z-axis CTE of 40.8ppm/°C
    Decomposition Temperature (Td) of 539°C
    Thermal Coefficient of Dielectric Constant of -8ppm/°C
    Tightest dielectric constant tolerance in the CLTE family (+/- .03)
    Low Moisture Absorption of 0.02%


    Benefits:

    High plated through-hole reliability
    Consistent performance across different production lots
    Reduced circuit losses while maintaining dimensional stability
    Stable dielectric constant under temperature variations, reducing stress on ceramic active devices


    PropertiesCLTE-XTUnitsTest ConditionsTest Method
    Electrical Properties
    Dielectric Constant2.94-23˚C @ 50% RH10 GHzIPC TM-650 2.5.5.5
    Dissipation Factor0.0010-23˚C @ 50% RH10 GHzIPC TM-650 2.5.5.5
    Dielectric Constant (design)2.93-C-24/23/5010 GHzMicrostrip Differential Phase Length
    Thermal Coefficient of Dielectric Constant-8ppm/˚C-50°C to 150°C10 GHzIPC TM-650 2.5.5.5
    Volume Resistivity4.25x10⁸Mohm-cmC-96/35/90-IPC TM-650 2.5.17.1
    Surface Resistivity2.49x10⁸MohmC-96/35/90-IPC TM-650 2.5.17.1
    Electrical Strength (dielectric strength)1000V/mil--IPC TM-650 2.5.6.2
    Dielectric Breakdown58kVD-48/50X/Y direc- tionIPC TM-650 2.5.6
    PIM (For antenna only)-dBc-50 ohm
    0.060"
    43dBm 1900 MHz
    Thermal Properties
    Decomposition Temperature (Td)539˚C2hrs @ 105˚C5% Weight LossIPC TM-650 2.3.40
    Coefficient of Thermal Expansion - x12.7ppm/˚C--55˚C to 288˚CIPC TM-650 2.4.41
    Coefficient of Thermal Expansion - y13.7ppm/˚C--55˚C to 288˚CIPC TM-650 2.4.41
    Coefficient of Thermal Expansion - z40.8ppm/˚C--55˚C to 288˚CIPC TM-650 2.4.41
    Thermal Conductivity0.56W/(m.K)-z directionASTM D5470
    Time to Delamination>60minutesas-received288˚CIPC TM-650 2.4.24.1
    Mechanical Properties
    Copper Peel Strength after Thermal Stress1.7
    (9)
    N/mm (lbs/ in)10s @288˚C35 μm foilIPC TM-650 2.4.8
    Flexural Strength (MD, CMD)40.7, 40.0
    (5.9, 5.8)
    MPa (ksi )25˚C  3˚C-ASTM D790
    Tensile Strength (MD, CMD)29.0, 25.5
    (4.2, 3.7)
    MPa (ksi )23C/50RH-ASTM D638
    Flex Modulus (MD. CMD)3247, 3261
    (471, 473)
    MPa (ksi )25C  3C-ASTM D790
    Dimensional Stability (MD, CMD)-0.37, -0.67mm/m4 hr at 105˚C-IPC-TM-650 2.4.39a
    Physical Properties
    FlammabilityV-0--C48/23/50 & C168/70UL 94
    Moisture Absorption0.02%E1/105+D24/23-IPC TM-650 2.6.2.1
    Density2.17g/cm³C-24/23/50-ASTM D792
    Specifc Heat Capacity0.61J/g˚K2 hours at 105˚C-ASTM E2716
    NASA Outgassing0.02 / 0.00%TML/CVCMASTM E595

    PCB Stackup:
    2-layer rigid PCB
    Copper_layer_1 - 35 μm
    Rogers CLTE-XT Core - 0.762 mm (30mil)
    Copper_layer_2 - 35 μm


    The PCB construction details for this High-Performance PCB are as follows:


    The board dimensions are 42.91mm x 108.31mm, with a tolerance of +/- 0.15mm for a single piece. The minimum trace width and spacing are 5 mils and 7 mils, respectively. The minimum hole size is 0.3mm, ensuring compatibility with a wide range of components.


    The board does not include any blind vias, simplifying the manufacturing process. The finished board thickness is 0.8mm, providing a balance between durability and space constraints. The outer layers have a copper weight of 1oz (equivalent to 1.4 mils), ensuring good electrical conductivity and heat dissipation.


    The via plating thickness is 20 μm, ensuring reliable connections throughout the board. The surface finish is immersion tin, which provides a protective coating and enhances solderability. The top silkscreen is printed in black, allowing for clear component labeling and identification. The bottom silkscreen is not included in this PCB design.


    The top and bottom solder masks are not applied in this particular PCB. However, this can be customized based on specific requirements. Prior to shipment, a 100% electrical test is performed on each PCB to ensure its functionality and adherence to quality standards.


    In terms of PCB statistics, this PCB includes a total of 21 components. There are 68 pads in total, with 41 being thru-hole pads and 27 being top surface mount technology (SMT) pads. There are no bottom SMT pads in this design. The PCB features 65 vias, facilitating connections between different layers. The design encompasses 3 nets, ensuring proper signal routing and integrity.


    The quality standard for this PCB is IPC-Class-2, which guarantees reliability and adherence to industry standards. The artwork format used for this design is Gerber RS-274-X, a widely accepted format in the PCB manufacturing industry. The CLTE-XT High-Performance PCB is available worldwide, ensuring accessibility for engineers and manufacturers across different regions.


    PCB material:Ceramic/PTFE Microwave Composite
    Designation:CLTE-XT
    Dielectric constant:2.94
    Layer count:Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
    Dielectric thickness:5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
    Copper weight:1oz (35µm), 2oz (70µm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Red, Yellow etc.
    Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin,ENEPIG, Bare copper, OSP, Pure gold plated etc..

    RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin


    Some Typical Applications:

    Advanced Driver Assistance Systems (ADAS)
    Patch Antennas
    Phased Array Antennas
    Power Amplifiers
    Ground-based and airborne communications and radar systems


    RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

    Quality RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin for sale
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