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8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen

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    Buy cheap 8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen from wholesalers
     
    Buy cheap 8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen from wholesalers
    • Buy cheap 8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen from wholesalers
    • Buy cheap 8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen from wholesalers
    • Buy cheap 8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen from wholesalers

    8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen

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    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen

    Introducing the newly shipped PCB built on RO4003C. This RO4003C PCB is a cutting-edge product that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Utilizing proprietary woven glass reinforced hydrocarbon/ceramics materials, this PCB offers exceptional performance at a fraction of the cost of conventional microwave laminates. With tight control over dielectric constant (Dk) and low loss, the RO4003C laminates provide a reliable and cost-effective solution for a wide range of applications.


    Key Features:

    Dielectric Constant (DK): 3.38 +/-0.05 at 10GHz
    Dissipation Factor: 0.0027 at 10GHz, 0.0021 at 2.5GHz
    Thermal Coefficient of Dielectric Constant: +40 ppm/°C
    Thermal Conductivity: 0.71 W/m/°K
    X Axis CTE: 11ppm/°C, Y Axis CTE: 14ppm/°C, Z Axis CTE: 46ppm/°C
    Low Moisture Absorption: 0.06%

    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes

    Benefits:

    Ideal for Multi-Layer Board (MLB) Constructions: The RO4003C material's dimensional stability, similar to that of copper, makes it perfect for mixed dielectric multi-layer board constructions.

    Cost-Effective Fabrication: Process the RO4003C PCB like FR-4 at a lower fabrication cost while maintaining high performance.

    Designed for Performance-Sensitive, High-Volume Applications: The PCB is engineered to meet the demands of performance-sensitive applications, enabling high-volume production.

    Competitive Pricing: Enjoy the benefits of advanced materials and performance without breaking the bank.


    8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen


    With a 2-layer rigid PCB stackup and a finished board thickness of 0.3mm, this PCB offers compact and reliable construction. It features a copper layer thickness of 35μm on both sides, ensuring excellent conductivity. The PCB's dimensions are precisely controlled at 28.33mm x 167.16mm (1PCS), with a tolerance of +/- 0.15mm. The minimum trace/space is set at 5/5 mils, providing flexibility for intricate designs. The PCB also supports minimum hole sizes of 0.2mm, while the absence of blind vias simplifies the manufacturing process.


    Quality is paramount, and this PCB adheres to the IPC-Class-2 standard. Each PCB undergoes a 100% electrical test before shipment, ensuring that it meets the required specifications and guarantees reliability. The supplied artwork is in Gerber RS-274-X format, a widely accepted industry standard that facilitates seamless integration into existing design workflows.


    The availability of this RO4003C PCB is not limited to specific regions; it is widely accessible worldwide. This global availability ensures that this PCB can be utilized across various industries and markets, meeting the diverse needs of customers.


    The RO4003C PCB finds its application in a range of advanced technologies. It is well-suited for cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, as well as LNBs for direct broadcast satellites.


    Upgrade your PCB designs with the RO4003C PCB, and experience the perfect blend of performance, cost-effectiveness, and reliability in a globally available solution.


    8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen

    Quality 8mil RO4003C High Performance PCB 2-layer Immersion Gold Black Silkscreen for sale
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