Sign In | Join Free | My himfr.com
himfr.com

Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Verified Supplier

5 Years

Home > RF PCB Board >

20mil DiClad 870 PCB 1OZ Copper Rigid Circuits

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap 20mil DiClad 870 PCB 1OZ Copper Rigid Circuits from wholesalers
     
    Buy cheap 20mil DiClad 870 PCB 1OZ Copper Rigid Circuits from wholesalers
    • Buy cheap 20mil DiClad 870 PCB 1OZ Copper Rigid Circuits from wholesalers
    • Buy cheap 20mil DiClad 870 PCB 1OZ Copper Rigid Circuits from wholesalers
    • Buy cheap 20mil DiClad 870 PCB 1OZ Copper Rigid Circuits from wholesalers

    20mil DiClad 870 PCB 1OZ Copper Rigid Circuits

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    20mil DiClad 870 PCB 1OZ Copper Rigid Circuits

    Introducing the DiClad 870 PCB, a newly shipped PCB that utilizes Rogers DiClad 870 laminates. These laminates are woven fiberglass reinforced, PTFE-based composites designed specifically for use as printed circuit board substrates. With their unique composition, the DiClad 870 laminates offer a lower dielectric constant (Dk) and dissipation factor, providing exceptional performance while maintaining a similar thickness to other laminates in the DiClad series.


    Key Features:
    - Dielectric Constant (Dk): 2.33 at 10 GHz and 1 MHz, 50% RH
    - Dissipation Factor: 0.0013 at 10 GHz, 0.0009 at 1 MHz, 50% RH
    - TcDK (Temperature Coefficient of Dk): -161 ppm/°C, operating from -10°C to 140°C at 10 GHz
    - Arc Resistance: >180 seconds
    - Low Moisture Absorption: 0.02%
    - Coefficient of Thermal Expansion (CTE): X-axis - 17 ppm/°C, Y-axis - 29 ppm/°C, Z-axis - 217 ppm/°C
    - Copper Peel Strength: 14 lbs/in, 10s @ 288°C
    - Flammability: UL 94V0 grade


    Benefits:
    - Lowest moisture absorption among PTFE-based composites
    - Stable Dk over a wide frequency range
    - Support for wider line widths, enabling lower insertion loss


    PropertyDiClad 870ConditionTest Method
    Electrical Properties
    Dielectric Constant @ 10 GHz2.33C23/50IPC TM-650 2.5.5.5
    Dielectric Constant @ 1 MHz2.33C23/50IPC TM-650 2.5.5.3
    Dissipation Factor @ 10 GHz0.0013C23/50IPC TM-650 2.5.5.5
    Dissipation Factor @ 1 MHz0.0009C23/50IPC TM-650 2.5.5.3
    Thermal Coefficient of Er (ppm/°C)-161-10°C to +140°CIPC TM-650 2.5.5.5
    Adapted
    Volume Resistivity (MΩ-cm)1.5 x 10 9C96/35/90IPC TM-650 2.5.17.1
    Surface Resistivity (MΩ)3.4 x 10 7C96/35/90IPC TM-650 2.5.17.1
    Arc Resistance>180D48/50ASTM D-495
    Dielectric Breakdown (kV)>45D48/50ASTM D-149
    Mechanical Properties
    Peel Strength (lbs.per inch)14After Thermal StressIPC TM-650 2.4.8
    Tensile Modulus (kpsi)485(MD), 346(CD)A, 23°CASTM D-638
    Tensile Strength (kpsi)14.9(MD), 11.2 (CD)A, 23°CASTM D-882
    Compressive Modulus (kpsi)327A, 23°CASTM D-695
    Flexural Modulus (kpsi)437A, 23°CASTM D-790
    Thermal Properties
    Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis17 29 2170°C to 100°CIPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer
    Thermal Conductivity (W/mK)0.257100°CASTM E-1225
    Flammability ULMeets requirements of UL94-V0C48/23/50, E24/125UL 94 Vertical Burn IPC TM-650 2.3.10
    Physical Properties
    Density (g/cm3)2.26A, 23°CASTM D-792 Method A
    Water Absorption (%)0.02E1/105 + D24/23MIL-S-13949H 3.7.7
    IPC TM-650 2.6.2.2
    Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)0.02 0.00 0.01 NO125°C, ≤ 10-6 torrNASA SP-R-0022A Maximum 1.00% Maximum 0.10%

    This PCB features a 2-layer rigid stackup for robust construction. The board consists of Copper Layer 1, with a thickness of 35 μm, followed by the DiClad 870 core, measuring 0.508 mm (20mil) in thickness. The stackup is completed with Copper Layer 2, matching the same 35 μm thickness. This configuration ensures reliable performance and efficient signal transmission throughout the circuit.


    The PCB construction details provide precise specifications for optimal performance. The board dimensions are set at 66.2 mm x 66.2 mm for a single piece, with a tolerance of +/- 0.15 mm. The minimum trace/space is 5/4 mils, allowing for intricate circuit designs. With a minimum hole size of 0.4 mm, the PCB accommodates various component types and facilitates efficient assembly.


    This PCB excludes blind vias, simplifying the manufacturing process. The finished board thickness is optimized at 0.6 mm for durability while maintaining a compact form factor. Copper weight is set at 1oz (1.4 mils) for the outer layers, ensuring efficient thermal management and reliable conductivity. Via plating thickness is 20 μm, further enhancing electrical connections.


    For surface finish, this PCB employs immersion silver, providing excellent conductivity and corrosion resistance. The absence of top and bottom silkscreens and solder masks streamlines the manufacturing process while maintaining functionality.


    To ensure the highest quality, each PCB undergoes a 100% electrical test before shipment. This comprehensive test guarantees the functionality and reliability of the board, giving you confidence in its performance.


    PCB material:Woven Fiberglass reinforced PTFE Laminates
    Designation:DiClad 870
    Dielectric constant:2.3
    Layer count:Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
    Dielectric thickness:31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm)
    Copper weight:1oz (35µm), 2oz (70µm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Red, Yellow etc.
    Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold plated etc..

    20mil DiClad 870 PCB 1OZ Copper Rigid Circuits


    With 16 components and a total of 40 pads, this PCB offers versatility for various electronic designs. It features 26 thru-hole pads and 14 top SMT pads, providing options for different component placement and assembly techniques. The PCB includes 15 vias for efficient signal routing and connectivity. With 2 nets, the board enables effective communication between components.


    The artwork format for this PCB is Gerber RS-274-X, a widely accepted industry standard. This PCB meets the IPC-Class-2 standard, ensuring reliable performance and quality. It is available for shipping worldwide, allowing you to access this advanced PCB for your projects, regardless of your location. Experience the reliability and versatility of the DiClad 870 PCB for your electronic designs.


    The DiClad 870 PCB is suitable for a range of applications, including radar feed networks, commercial phased array networks, low-loss base station antennas, guidance systems, digital radio antennas, and components like filters, couplers, and low-noise amplifiers (LNAs). Harness the exceptional performance and reliability of the DiClad 870 PCB to unlock the full potential of your electronic designs.

    Quality 20mil DiClad 870 PCB 1OZ Copper Rigid Circuits for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)