Introducing our exceptional hybrid PCB, combining the advanced features of Rogers RO4003C and Shengyi S1000-2 materials. This meticulously crafted PCB offers outstanding electrical performance, low loss, and cost-effectiveness, making it an ideal choice for a wide range of applications, including point-to-point digital radio antennas, cellular base station antennas, automotive radar systems, and much more.

RO4003C Features:

RO4003C laminates from Rogers are proprietary woven glass reinforced hydrocarbon/ceramic materials designed to deliver exceptional electrical performance and manufacturability. Key features include:

- Tight Control on Dielectric Constant: RO4003C ensures precise control of dielectric constant (Dk) with a value of 3.38 +/- 0.05, providing reliable signal transmission.

- Low Loss Tangent: With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal loss and exhibits excellent high-frequency performance.

- Low Z-Axis CTE: RO4003C showcases a low coefficient of thermal expansion (CTE) of 46 ppm/°C in the Z-axis, ensuring outstanding dimensional stability and reliability.

S1000-2 Features:

S1000-2 materials from Shengyi are lead-free compatible FR-4 laminates known for their high thermal resistance, low CTE, and excellent through-hole reliability. Notable features include:

- High Thermal Resistance and Tg: S1000-2 boasts a high glass transition temperature (Tg) of 170°C (DSC), making it suitable for applications with elevated operating temperatures. It also exhibits excellent UV blocking and AOI compatibility.

- Low Z-Axis CTE: With a low CTE of 45 ppm/°C before Tg, S1000-2 provides exceptional dimensional stability, ensuring reliable performance in various conditions.

- Outstanding Mechanical and Electrical Properties: S1000-2 offers excellent anti-CAF (Conductive Anodic Filament) performance, low water absorption of 0.1%, and reliable through-hole reliability.

Hybrid PCB Construction:

This hybrid PCB combines the benefits of RO4003C and S1000-2 materials to meet specific requirements. RO4003C, known for its high-frequency performance and stability, is strategically used in critical areas such as RF transmission lines and sensitive signal paths. S1000-2, a cost-effective and versatile FR-4 material, is employed in other areas of the PCB where high-frequency performance is not as crucial, such as power distribution and mechanical support. This hybrid design achieves a balance between performance and cost-effectiveness.

PCB Construction and Specifications:

This hybrid PCB features a 6-layer rigid construction, meticulously designed to meet demanding requirements. Here are the key specifications:

- Board Dimensions: The PCB dimensions are precisely maintained at 82.5mm x 66mm (1PCS) with a tolerance of +/- 0.15mm.

- Trace/Space and Hole Size: The minimum trace/space is 4/6 mils, allowing for fine routing. The minimum hole size is 0.35mm, accommodating various component requirements.

- Stackup Configuration: The stackup consists of copper layers, RO4003C and S1000-2 cores, and prepreg layers, providing optimal performance and reliability.

- Finished Board Thickness and Copper Weight: The finished board thickness is 1.1mm, ensuring durability. Each layer has a copper weight of 1oz (1.4 mils), enabling efficient conductivity.

- Via Plating and Surface Finish: The via plating thickness is 20μm, ensuring reliable interconnectivity. The surface finish is immersion gold, providing excellent solderability and corrosion resistance.

- Silkscreen and Solder Mask: The top silkscreen is in white, enhancing component visibility. The bottom silkscreen is not applied. The top and bottom solder masks are in matte green, offering reliable protection.

- Electrical Testing and Quality Standard: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The product complies with the IPC-Class-2 quality standard, ensuring reliability and consistent performance.

Artwork, Availability, and Applications:

This hybrid PCB with RO4003C and S1000-2 materials is compatible with Gerber RS-274-X artwork, ensuring seamless integration into your design workflow. It is readily available worldwide, providing easy accessibility to designers and manufacturers seeking top-tier PCB solutions.

Unlock the full potential of your high-frequency applications with our advanced hybrid PCB. Experience exceptional electrical performance, reliability, and cost-effectiveness by choosing our hybrid solution. Elevate your designs to new heights and enjoy the benefits of both RO4003C and S1000-2 materials.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners