Sign In | Join Free | My himfr.com
himfr.com

Bicheng Electronics Technology Co., Ltd

We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified

Verified Supplier

5 Years

Home > RF PCB Board >

20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits

Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap 20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits from wholesalers
     
    Buy cheap 20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits from wholesalers
    • Buy cheap 20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits from wholesalers
    • Buy cheap 20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits from wholesalers

    20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits

    Ask Lasest Price
    Brand Name : Bicheng
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99/PCS
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits

    Introducing a newly shipped PCB based on the RO4003C material. The RO4003C PCB, utilizing Rogers Corporation's proprietary woven glass reinforced hydrocarbon/ceramics materials, combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This groundbreaking PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.


    Key Features:

    Unmatched Electrical Performance: The RO4003C PCB boasts an impressive dielectric constant (DK) of 3.38 +/- 0.05 at 10GHz, ensuring accurate signal transmission and reception. With a low dissipation factor of 0.0027 at 10GHz, it minimizes signal loss, providing superior performance in high-frequency applications.


    Enhanced Thermal Management: Engineered with a thermal conductivity of 0.71 W/m/°K, the RO4003C PCB excels at dissipating heat efficiently. Its low coefficient of thermal expansion (CTE) matched to copper (11ppm/°C in the X-axis, 14ppm/°C in the Y-axis) guarantees thermal stability, even in extreme temperature conditions (-50°C to 150°C).


    Cost-Effective Solution: The RO4003C PCB offers the same processing method as standard epoxy/glass, eliminating the need for special through-hole treatments or handling procedures. This results in lower fabrication costs compared to conventional microwave laminates, making it an economical choice for high-performance applications.


    Versatility and Reliability: Designed for multi-layer board (MLB) constructions, the RO4003C PCB is ideal for performance-sensitive, high-volume applications. Its competitive pricing, combined with exceptional electrical characteristics, ensures reliable and cost-effective solutions.


    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23
    2.5 GHz/23
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/-55to288IPC-TM-650 2.4.41
    Tg>280 TMAAIPC-TM-650 2.4.24.3
    Td425 TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50
    ASTM D 570
    Density1.79gm/cm323ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes

    20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits


    Featuring a 2-layer rigid PCB stackup with a copper layer thickness of 35 μm (outer layers) and a Rogers 4003C core thickness of 0.508 mm (20mil), this PCB provides a solid foundation for your projects. It has a board dimension of 43.88mm x 33.2 mm, allowing for compact and efficient layouts.


    With a minimum trace/space of 5/5 mils and a minimum hole size of 0.3mm, the RO4003C PCB supports intricate and precise circuit designs. It has a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on outer layers, ensuring durability and reliability.

    Each PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, ensuring its quality and adherence to IPC-Class-2 standards. The availability of worldwide shipping ensures easy access to this high-performance PCB.


    Some typical applications of the RO4003C PCB include cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites. Choose the RO4003C PCB to unleash the power of high-frequency performance in your advanced applications. Trust Rogers Corporation's expertise in cutting-edge PCB materials for superior results.


    20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits

    Quality 20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)