Introducing a newly shipped PCB which is crafted with Rogers AD250C commercial microwave and RF laminate material. This 2-layer rigid PCB combines advanced composite chemistry and construction techniques to deliver unparalleled price-performance for today's telecommunication infrastructure.

Key Features:

Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates: The AD250 PCB utilizes high-quality laminates that provide exceptional mechanical strength and resilience.

Controlled Dielectric Constant: With a low and tightly controlled dielectric constant of 2.50, the AD250 PCB ensures optimal signal integrity and efficient transmission across a wide range of frequencies.

Low Loss Tangent: The AD250 PCB boasts an impressively low loss tangent (<0.002 at 10 GHz), enabling outstanding circuit performance in all typical wireless frequency bands.

Excellent Dimensional Stability: The AD250 PCB offers excellent dimensional stability, leading to repeatable circuit performance and improved manufacturing yields. It also enhances plated through-hole (PTH) reliability compared to typical PTFE-based laminates.

Very Low PIM: With an outstanding PIM rating of -159 dBc at 30 mil and 1900 MHz, the AD250 PCB ensures excellent antenna performance and minimizes yield loss associated with PIM-related issues.

Controlled Dielectric Constant (±0.05): The AD250 PCB provides a controlled dielectric constant, guaranteeing repeatable circuit performance and a higher degree of stability during temperature changes.

Benefits:

Unmatched Circuit Performance: The AD250 PCB ensures excellent circuit performance in all typical wireless frequency bands, guaranteeing seamless communication and optimal signal transmission.

Enhanced Antenna Efficiencies: With its low loss tangent and controlled dielectric constant, the AD250 PCB maximizes antenna efficiencies, resulting in improved signal reception and transmission capabilities.

Reliable Dk Stability: The AD250 PCB's ceramic construction provides a higher degree of dielectric constant stability during temperature changes, ensuring consistent circuit performance in varying environmental conditions.

This PCB is a 2-layer rigid printed circuit board with a well-optimized stackup for excellent performance. The stackup consists of a copper layer on the top side, measuring 35 μm in thickness, followed by the TSM-DS3 core layer, which is 0.127 mm (5mil) thick, and finally, another copper layer on the bottom side, also measuring 35 μm. This stackup ensures reliable signal transmission and efficient thermal management.

When it comes to construction details, this PCB offers precise specifications to meet your requirements. The board dimensions are 82mm x 82mm, allowing for a single PCB in each order, with a tight tolerance of +/- 0.15mm. The minimum trace/space is set at 4/7 mils, enabling intricate circuit designs. The minimum hole size is 0.4mm, providing flexibility for component mounting.

This PCB has a finished board thickness of 0.2mm, contributing to its compact form factor. The finished copper weight on the outer layers is 1oz (1.4 mils), ensuring robust conductivity and durability. Via plating thickness is 20 μm, promoting reliable interconnection between layers. The surface finish is achieved with immersion silver, which enhances solderability and corrosion resistance.

In terms of aesthetics, this PCB doesn't feature a top or bottom silkscreen, giving it a clean and minimalistic appearance. It also lacks a top and bottom solder mask, allowing for direct visual inspection of the copper traces. Before shipment, each PCB undergoes a thorough 100% electrical test to ensure it meets the required specifications and quality standards.

It supports a total of 36 components, with 163 pads available for seamless component integration. This PCB incorporates 132 thru-hole pads and 31 top surface mount technology (SMT) pads. There are no bottom SMT pads. With 151 vias and 2 nets, the PCB facilitates efficient signal routing and connectivity.

Type of artwork supplied: Gerber RS-274-X

Accepted standard: IPC-Class-2

Availability: worldwide

Some Typical Applications:
Couplers
Phased Array Antennas
Radar Manifolds
mmWave Antenna/Automotive
Oil Drilling
Semiconductor/ATE Testing

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners