The RO3203 PCB is engineered from high-frequency circuit materials that combine ceramic-filled laminates with woven fiberglass reinforcement. Part of the renowned RO3000 Series, this laminate is designed for exceptional electrical performance and enhanced mechanical stability, making it suitable for demanding applications beyond 40 GHz. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, the RO3203 PCB provides reliable solutions for high-frequency circuit designs.

Features
Material Type: Ceramic-filled PTFE composites
Dielectric Constant: 3.02 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Degradation Temperature (Td): > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion (CTE):
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C

Flammability Rating: 94V-0, lead-free process compatible

Benefits
Improved Rigidity: Woven glass reinforcement allows for easier handling.
Consistent Performance: Ideal for complex multi-layer high-frequency structures.
Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
Expansion Coefficient Matching: Low in-plane expansion coefficient for reliable surface-mounted assemblies.
High Dimensional Stability: Ensures excellent production yields.
Cost-Effective: Economically priced for volume manufacturing.
Surface Smoothness: Facilitates finer line etching tolerances.

Technical Specifications

Stackup Configuration: 2-layer rigid PCB

Copper Layer 1: 35 μm
RO3203 Substrate: 30 mil (0.762 mm)
Copper Layer 2: 35 μm

Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.55 mm
Vias: 27 (no blind vias)
Surface Finish: Immersion Silver
Silkscreen: None on top or bottom
Solder Mask: None on top or bottom
Electrical Testing: 100% electrical test conducted prior to shipment

Quality Standards
This PCB meets IPC-Class-2 standards, ensuring high reliability for various applications.

Typical Applications
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

Availability
The RO3203 PCB is available worldwide, making it an excellent choice for engineers and designers in need of high-performance RF and microwave solutions.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners