The RO3035 PCB features high-frequency ceramic-filled PTFE laminates, part of Rogers' RO3000 series. Designed for exceptional performance in multi-layer board applications, RO3035 laminates provide a stable dielectric constant across varying temperatures, making them ideal for 5G, millimeter wave sub-6GHz, and massive MIMO applications. Their mechanical stability ensures reliability and minimizes warping, allowing for innovative designs without compromise.

Key Features
Material Composition: Ceramic-filled PTFE composites for superior performance.
Dielectric Constant: 3.5 ±0.05 at 10 GHz/23°C, ensuring excellent signal integrity.
Dissipation Factor: Low at 0.0015 at 10 GHz/23°C, reducing energy loss.
Thermal Degradation Temperature (Td): > 500°C for enhanced thermal stability.
Thermal Conductivity: 0.5 W/mK, effective for heat dissipation.
Moisture Absorption: Only 0.04%, ensuring reliability in diverse environments.
Coefficient of Thermal Expansion (CTE):
X-axis: 17 ppm/°C
Y-axis: 17 ppm/°C
Z-axis: 24 ppm/°C

Benefits
The RO3035 PCB provides several advantages:

High Frequency Capability: Can be used in applications up to 30-40 GHz.
Increased Reliability: Lower operating temperatures enhance performance in power amplifiers.
Uniform Mechanical Properties: Suitable for multi-layer board designs with varying dielectric constants, including epoxy glass hybrid designs.
Low In-Plane Expansion Coefficient: Matches closely with copper, ensuring reliable surface-mounted assemblies and excellent dimensional stability.
Cost-Effective: Economical laminate pricing makes it ideal for volume manufacturing.

PCB Stackup Configuration
The RO3035 PCB features a 2-layer rigid stackup:

Copper Layer 1: 35 μm
RO3035 Substrate: 20 mil (0.508 mm)
Copper Layer 2: 35 μm

This configuration yields a finished board thickness of 0.6 mm, with the outer layers featuring a total copper weight of 1 oz (1.4 mils).

Construction Details
Board Dimensions: 548 mm x 238 mm (1 piece)
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.35 mm
No Blind Vias included in the design.
Via Plating Thickness: 20 μm
Surface Finish: Immersion Silver for excellent solderability.
Silkscreen and Solder Mask: White top silkscreen; blue top solder mask; no bottom silkscreen or solder mask.
Quality Assurance: Each PCB undergoes a 100% electrical test prior to shipment to ensure reliability.

Quality Standards
This PCB adheres to the IPC-Class-2 quality standard, ensuring high reliability for a variety of applications.

Typical Applications
The RO3035 PCB is well-suited for a range of applications, including:

Automotive Radar Applications
Global Positioning Satellite Antennas
Cellular Telecommunications Systems: Including power amplifiers and antennas.
Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes

Availability
The RO3035 PCB is available for worldwide customers, making it an excellent choice for engineers and designers seeking high-performance solutions for advanced RF applications.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners